Signal Integrity Journal

The rise of AI and data centers is placing higher performance demands on systems than ever before, which requires increasingly advanced chiplet designs. The need to meet this level of performance has driven the development of new compliance standards for communication between chiplets with advanced packages.

The memory wall, once a niche topic for computer architects arguing over cache hierarchies, now shapes how AI data centers are physically built. As large language models move from training into round-the-clock inference, the industry is now pushing against the limits of physics. The problem is how to move enough bytes between memory and logic, and between accelerators, within...

At data rates of 100 Gb/s and beyond, RF cable instability can affect the accuracy, repeatability, and confidence of high-speed differential channel measurements. This white paper explores how Maury Microwave stable RF cable assemblies can help minimize cable-induced variations and create a more reliable measurement environment.

Learn about the sources of noise in high-speed sampling systems and how they impact measurements across ranges, bandwidth, and sampling. We will discuss the keys to avoiding measurement error and making sure to accurately compare apples to apples when discussing noise performance along with the Siglent SDS7804AP oscilloscope.

This application note presents an efficient methodology for modeling 3D interconnects incorporating hatched return planes in silicon interposers, silicon bridges, and flex PCBs. The approach combines a specially designed quasi-static 2D field solver with full 3D electromagnetic analysis within a mixed-domain modeling framework.