Signal Integrity Journal

The rapid growth in Data Centers, AI, and supercomputing demands significantly faster edge rates at the package and PCB levels, necessitating superior power delivery network (PDN) solutions.

Modern AI and datacenter systems, equipped with complex multi-domain Power Distribution Networks (PDNs), grapple with substantial challenges stemming from large-signal crosstalk and ground bounce.

This eBook explores how multiphysics simulation is enabling engineers to address the growing complexity of advanced packaging and signal integrity design. Covering topics such as high-speed interconnects, advanced substrates, heterogeneous integration, thermal management, and system reliability, the collection demonstrates how simulation helps predict performance and reduce d...

While global manufacturing continues to push toward more automated production, unplanned outages now cost the sector an average of $852 million every week. As factories integrate high-speed data signals alongside mixed-voltage power architectures, the physical layer has become a determining factor in system stability rather than a background consideration.

Can copper continue to scale for next-generation AI data center interconnects? Developed by TE Connectivity in collaboration with Semtech, this DesignCon 2026 Best Paper Award-winning technical paper explores passive and active copper architectures—including DAC, ACC, and Co-Packaged Copper (CPC)—and how they can help enable the transition to the 448G era.