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Site title: PCB Fabrication, Assembly, and Components | Sierra Circuits
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Key design strategies for enhancing microvia reliability include selecting suitable materials for laser drilling, adhering to IPC-T-50M guidelines, and implementing stack-up configurations in alignment with IPC-2226 standards.
Microvia failure occurs due to the thermal stresses that arise during the PCB assembly process. These stresses can have a significant impact on ...
When selecting flex PCB materials, you need to consider the application type (dynamic or static), stiffener requirements, and routing needs.
For instance, choose adhesiveless copper-clad laminate for fine-pitch designs to ensure dimensional stability and good heat resistance. Likewise, use rolled annealed (RA) copper for dynamic applications, and select FR4 or polyimid...
PCB solder mask clearance is the space between a copper pad and the surrounding solder resist. It typically ranges from 2 to 7 mil depending on the component.
Different parts, such as resistors, BGAs, and ICs, have distinct clearance requirements to ensure efficient soldering. For instance, BGAs need about 3 mi...
When routing high-speed PCBs, always place a solid ground plane beneath signal traces to maintain signal integrity and reduce EMI. Arrange vias in a grid pattern to prevent plane voids and hot spots that can disrupt current flow. Maintain symmetry and consistent spacing between differential pair traces to preserve impedance balance and minimize crosstalk.
At gigahertz ...
High-leakage current in PCBs is caused by moisture absorption and inadequate creepage and clearance distances. You can prevent it by maintaining sufficient spacing and selecting a laminate with a CTI greater than 400 V.
Leakage current can distort signals, increase board temperature, and reduce insulation r...
