Follow Semiconductor Engineering's news and updates in a matter of seconds! We will deliver any update via email, phone or you can read them from here on the site on your own news page.
You can even combine different feeds with the feed for Semiconductor Engineering.
Subscribing and unsubscribing is fast, easy and risk free.
The whole service is free of cost.
Semiconductor Engineering: Semiconductor Engineering - Deep Insights For Chip Engineers
Is this your feed? Claim it!
A new technical paper titled “Hybrid surface pre-treatments for enhancing copper-to-copper direct bonding” was published by researchers at National Chung Hsing University (NCHU) and Osaka University.
Abstract excerpt
“Three-dimensional integrated circuits (3D IC) require low-temperature, high-reliability Cu–Cu d...
Researchers from University of Florida published “IFV: Information Flow Verification at the Pre-silicon Stage Utilizing Static-Formal Methodology.”
Abstract
“Modern system-on-chips (SoCs) are becoming prone to numerous security vulnerabilities due to their ever-growing complexity and size. Therefore, a comprehensive security ver...
University of Arizona researchers published “Antiferromagnetic Tunnel Junctions (AFMTJs) for In-Memory Computing: Modeling and Case Study.”
Abstract
“Antiferromagnetic Tunnel Junctions (AFMTJs) enable picosecond switching and femtojoule writes through ultrafast sublattice dynamics. We present the first end-to-end AFMTJ simulation framework integ...
Key Takeaways
Variation becomes a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI can play a significant role in distinguishing between yield-killing and nuisance variations and significantly reduce false positives.New methods for interconnecting devices using throug...
The semiconductor industry is defined by its relentless pursuit of smaller, faster, and more powerful chips. As we push into advanced 3D architectures like gate-all-around (GAA) transistors, a critical challenge emerges: finding the defects that kill yield. Many of these flaws are deeply buried within complex structures and impossible to see with traditional optical inspectio...