Semiconductor Engineering

Nearly all leading-edge designs today are multi-die assemblies, which means that one defective die can render the entire device unusable. But not all dies that are deemed defective should be scrapped, and not all dies that pass inspection will behave as expected in the field, especially over time. Nir Sever, senior director of business development at proteanTecs, explains how...

Researchers from the National University of Singapore developed an atom-thin film of amorphous carbon designed to insulate increasingly thin copper interconnect wir...

New technical papers recently added to Semiconductor Engineering’s library:

Hong Kong Polytechnic University-led researchers developed a 2D tunnel transistor that can switch at lower voltages than conventional MOSFETs while maintaining strong current performance. The device was demonstrated at roo...

The complexity of modern electronic systems is growing faster than traditional engineering workflows can efficiently manage. High-speed interfaces, dense PCB layouts, advanced packaging technologies, and increasingly stringent performance requirements are forcing organizations to rethink how design decisions are made, validated, and optimized.

This challenge is driving...