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John Kibarian, CEO of PDF Solutions, talks with Semiconductor Engineering’s Ed Sperling about the growing role of AI in chip manufacturing, the impact of 3D-ICs on the supply chain, and how to shorten cycle time to get leading-edge chips and multi-die assemblies to market more quickly.
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The promise of AI dominated the last quarter of 2025. Investors were eager to claim stakes in both brand-new startups and more established companies developing AI-specific hardware, primarily for data centers, with over $1 billion alone flowing into the sector. The largest round of the quarter went to a new entrant aiming to fundamentally change how AI compute is performed, w...
A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging” was published by researchers at National Yang Ming Chiao Tung University.
Abstract
“This work investigates the thermal stability of Cu-Cu bonding using a thin Ag passivation layer in a...
Geopolitics
Taiwan and the U.S. signed a trade agreement this week, with Taiwanese companies, led by TSMC, pledging to invest at least $...
Over the past several decades studying verification practices across the semiconductor industry, I’ve watched assumptions that once held up remarkably well begin to strain under the weight of modern system complexity. This is not a loss of engineering rigor. It is the result of systems that no longer conform to the boundaries earlier design models depended on.
For much...
