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A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging” was published by researchers at National Yang Ming Chiao Tung University.
Abstract
“This work investigates the thermal stability of Cu-Cu bonding using a thin Ag passivation layer in a...
Geopolitics
Taiwan and the U.S. signed a trade agreement this week, with Taiwanese companies, led by TSMC, pledging to invest at least $...
Over the past several decades studying verification practices across the semiconductor industry, I’ve watched assumptions that once held up remarkably well begin to strain under the weight of modern system complexity. This is not a loss of engineering rigor. It is the result of systems that no longer conform to the boundaries earlier design models depended on.
For much...
Signal integrity is one of the many challenges faced by chip designers. Deep submicron technologies are unfriendly hosts for the nice, clean signals desired. The culprits that compromise signal integrity and introduce jitter include thermal effects, manufacturing flaws, signal crosstalk, IR (voltage) drop, signal loss over long runs, reflections, electromagnetic interference ...
The AI hardware landscape continues to evolve at a breakneck speed, and memory technology is rapidly becoming a defining differentiator for the next generation of GPUs and AI inference accelerators. When NVIDIA introduced Rubin CPX, its new class of GPU tailored for massive context inference, it underscored a new industry reality: memory throughput and efficiency are now...
