Engineers Garage

PIC18F-Q35 MCUs are a scalable 8-bit MCU platform for embedded designs that require flexible peripheral integration, deterministic logic control, and built-in security. The family integrates a 128-BLE Configurable Logic Block, DMA, 10-bit ADCC, DAC, comparators, timers, PWM modules, and standard serial interfaces to help reduce external component count and streamline real-tim...

Innodisk has introduced the DDR5 12800 MT/s MRDIMM for AI, large language model, high-performance computing and robotics workloads. The module uses Multiplexed Registering Clock Driver and Multiplexed Data Buffer architecture to support simultaneous two-rank access and increase bandwidth by 60% compared with DDR5 8000 MT/s RDIMMs. It is compatible with standard DDR5 RDIMM slo...

Amphenol TPC Wire & Cable has introduced Trex-Onics® high flex single pair ethernet cable for continuous-motion applications in robotics, cable carriers and automated equipment. The cable supports 1 Gbps data transmission up to 40 m and uses finely stranded copper conductors with Ultra-Shield EMI/RFI protection, including tinned copper braid, foil shield and tinned drain ...

Ambiq® has released the Apollo330 Plus and Apollo510 Lite SoC series for battery-powered edge AI devices, including wearables, hearables, AR devices, digital health monitors and industrial sensors. The Arm® Cortex®-M55-based devices include up to 2 MB SRAM and 2 MB embedded NVM, AI acceleration up to 8 MACs per cycle, secureSPOT® 3.0 with Arm TrustZone®…

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Qnity Electronics, Inc. has introduced Laird™ Tflex™ CR910 dispensable liquid gap filler and Laird™ Tgrease™ 3000 thermal grease for thermal management in AI, automotive and high-power electronics. Tflex™ CR910 provides 9.2 W/mK thermal conductivity and a compliant material profile for large or uneven gap tolerances. Tgrease™ 3000 is a non-silicone thermal grease rated for op...