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As data-center rack densities climb and AI/HPC workloads expand, cooling infrastructure must evolve. Traditional approaches face growing limitations in capacity, scalability, efficiency and footprint. The Airsys PowerOne platform addresses these challenges through a modular, multi-medium cooling architecture engineered for modern […]
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Abstract This paper presents a novel thermal management approach for power semiconductor modules by integrating active liquid cooling directly into the substrate. Utilizing Direct Bond Copper (DBC) structures embedded within liquid cold plates, the method minimizes thermal interfaces, improves power […]
The post href="https://www.electronics-cooling.com/2025/11/dire...
Introduction The introduction of large language models (LLM), such as ChatGPT, has made artificial intelligence highly accessible. One of the key driving forces behind this growth has been the advancement in the processing power of compute devices such as central […]
The post href="https://www.electronics-cooling.com/2025/11/simulation-of-two-phase-microchannel-heat...
Gates Corporation, a global manufacturer of innovative, highly engineered power transmission and fluid power solutions, has launched Data Master™ Eco. This next-generation liquid cooling solution is designed to support hyperscale data centers and high-performance computing (HPC) conditions to maximize uptime, […]
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Boston, MA – November 5, 2025 – Alloy Enterprises today announced a breakthrough in data center cooling: single-piece, leak-tight cold plates that extend direct liquid cooling (DLC) across the blade, including DIMMs, NICs, and QSFPs. Built using the company’s patented […]
The post href="https://www.electronics-cooling.com/2025/11/alloy-enterprises-extends-direct-liq...
