Edge AI and Vision Alliance

Where AI Falls Short

Mon, 18 Jan 2021 15:39:32 GMT

This blog post was originally published at Intel’s website. It is reprinted here with the permission of Intel.

My colleague Abigail Wen is interviewing some of the greatest minds in artificial intelligence (AI) with her new podcast—Intel on AI. From Ivy-league professors to Fortune 50 executives, I’m pleasantly surprised to hear how many experts in the field are concerned with the potential for AI to impact society in negative ways.

Episode 7 address this issue directly with guest Yeshimabeit (Yeshi) Milner, founder of Data for Black Lives. In the episode, Yeshi and Abigail discuss why Data for Black Lives, a community of over 4,000 professionals, is working to breakdown the silos between scientists and activists.

“Models aren’t neutral; no data is neutral.”

-Yeshi Milner

A History of Inequality

In a previous episode of the podcast, MIT’s Bernhardt Trout talked about some of the ethical quandaries AI is leading us into, and that while many of these questions are not new to humanity, advancements in things such as autonomous driving are forcing moral dilemmas to the forefront. While Bernhardt recognizes that the technologies themselves being developed are important to consider, he says, “But, perhaps a more important issue is how well we face that technology.”

Yeshi’s work with Data for Black Lives takes a similar approach, pushing to make sure people involved in developing and implementing algorithms that will have major influence on lives are reflective of the communities that will be most impacted. For example, Yeshi talks about the history of homeownership in America and how seemingly well-intentioned technology widened disparity gaps.

During the New Deal of the 1930s, the Home Owners’ Loan Corporation was established to refinance nearly one out of every five private mortgages in urban areas to offset the devastation of the Great Depression. Part of this work included the creation of “Residential Security” maps to assess the mortgage leading risks in certain areas. Neighborhoods considered high risk were often denied loans from financial institutions to improve housing and other economic opportunities, a process that came to be known as “redlining.” Soon after in the 1950s, engineer Bill Fair and mathematician Earl Isaac created the data analytics company FICO while working at the Stanford Research Institute, pioneering the practice of credit scoring that has become the standard for American private loan investment. But by using data steeped in exclusionary practices, such credit scores can further economic inequality.

Outcome vs. Intention

On its face, a risk assessment model benefits lender and borrower—an accurate assessment of ability to repay and avoid either harmful over-lending, as happened in the run-up to the 2008 financial crisis, or under-lending, reducing access to the credit so important to home purchases and business expansion. Reducing the discretion of the branch manager who used to make these decisions should prevent bias against borrowers, but as Yeshi notes, when these models are based on deeper historical inequalities, they can make matters worse by locking out entire generations from economic opportunities being offered to others; something Mehrsa Baradaran from University of California, Irvine School of Law has studied in the research paper “Jim Crow Credit.”

Credit scores have a complicated interaction with racial bias in the US, where they are commonly used as a screening tool by hiring managers, despite weak evidence of effectiveness for this purpose. There’s obvious potential for a vicious cycle—unemployment leading to debt, leading to further unemployment—and so several states have banned the practice. However, a paper from researchers at Harvard and the Boston Federal Reserve showed that while this well-intentioned measure decreased unemployment overall, it increased Black unemployment. One hypothesis for the mechanism is that without the “objective” signal of the credit score, some hiring managers leaned more heavily on their own intuitions and biases.

Exacerbating Underlying Problems

Today, a host of financial technology (fintech) companies are launching to find new ways to provide credit to people all over the planet, promising to change outdated models of risk. Yet research from Harvard suggests borrowers using these newer services could be more likely to default. As non-profit organizations like World Bank attempt to end extreme poverty with the assistance of AI projects, the tools being used must be carefully considered because AI can act as an amplifier for human bias.

Intel’s Sandra Rivera and DataRobot’s Ben Taylor talked about the issues of bias in hiring and employment during a previous podcast episode, and Yeshi echoes their observations by highlighting how bias can unfortunately be built-in to too many technologies, such as facial recognition as studied by MIT researcher Joy Buolamwini or in medical race-adjusted algorithms as Dr. Darshali Vyas wrote in The New England Journal of Medicine.

The Dangerous of Misuse and Mistrust

How AI is used in health care is a critical questions because it is one of the most promising areas of applications, yet also ripe for the most potential exploitation, misuse, or mistrust. Yeshi noted that increasingly high COVID-19 rates in Miami caused the city to launch a random screening process with the University of Miami Miller School of Medicine earlier this year, but the program was quickly met with backlash over fears that outcome bias could lead to more aggressive restrictions among certain communities. Similar fears were stoked in Minnesota when a state official used the phrase “contact tracing” in reference to investigating protesters arrested during demonstrations against police brutality.

A foreigner living an entire ocean away from the US, I listened to this episode as many of you will—as an outsider from a society with very different fault lines. However, the themes of public trust as key to the adoption of new technology are universal. For example, many mobile network towers have been attacked across Europe due to unsubstantiated 5G fears, and diseases like measles have returned partially due to unfounded fears of vaccination. Trust is a key foundation of public policy too: during my time at Intel I’ve been seconded to NCMEC, where I worked on automated systems that detect the sharing of child sexual abuse imagery and report it to national authorities—systems that, absent a last-minute derogation, will be turned off in the EU as new laws come into effect to strengthen privacy protections for users of instant messaging systems.

Done right, analytics and AI can give us tools that are more effective, more transparent, and fairer than those they replace. But this podcast shows the degree of care that is necessary not only to get it right, but to be seen to get to right, too. Without the trust of the public, technical solutions, however worthy, are doomed.

The entire podcast episode with Yeshi and Abigail is worth listening to, as are the other episodes in the series. Listen to more episodes at: https://www.intel.com/content/www/us/en/artificial-intelligence/podcast.html

To learn more about Intel’s work in AI, visit: https://intel.com/ai

Edward Dixon
Data Scientist, Intel

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"Lessons From the Start-up Trenches,” a Presentation by and Interview with Oliver Gunasekara

Mon, 18 Jan 2021 09:00:09 GMT

Independent consultant Oliver Gunasekara and Shweta Shrivastava, chief product officer at Nauto, present the “Lessons From the Start-up Trenches” tutorial at the September 2020 Embedded Vision Summit. This interview with Oliver Gunasekara, founder and CEO of NGCodec, explores lessons learned during the journey of NGCodec—a video codec developer—from its founding…

“Lessons From the Start-up Trenches,” a Presentation by and Interview with Oliver Gunasekara

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Server Computing: A Data-intensive Market Propelled by AI

Fri, 15 Jan 2021 16:41:58 GMT

OUTLINE:

Market forecasts:

Yole Développement (Yole) expects the server computing market to reach US$33 billion in 2025.

AI and HPC dedicated products combined will reach 29Munits and US$8 billion in 2025.

Configurable SoC dedicated to AI inference will be more used following AI’s hype.

The CPU revenue will reach US$21 billion in 2025, driven by Standard Cloud servers and HPC.

Yole expects a 11% CAGR 2019−2025 for the HPC segment.
Market and technology trends:

Social and media applications are growing strongly, more workload needs to be computed.

Enterprise digitalization enhances the demand for hardware for virtualization and cloud computing for enterprises.

5G arrival will likely lead to a bunch of all new applications.

Limiting power consumption is critical to prevent an explosion in electricity consumption.
Supply chain:

Some big tech players are designing their own chips.

Intel, Nvidia, AMD, and Xilinx, the few logic leaders, still by far owned the largest part.

“Between new opportunities and requirements brought by 5G, high-end AI and HPC computing workloads, and growing pressure to limit and in fact reduce power consumption, the datacenter server computing market is facing many technical challenges.” asserts Adrien Sanchez, Technology & Market Analyst, Computing & Software division at Yole Développement (Yole).

What are the benefits and pitfalls of the various types of IC, with a focus on CPU , GPU , and PLP such as FPGA s and AI accelerators? What are the dynamics and outcomes of technology trends such as workload specialization and unit integration?

In this context, Yole investigates disruptive technologies and related markets in depth, to point out the latest innovations and underline the business opportunities.

Released today, the Computing for Datacenter Servers 2021 report contributes to the understanding of the impact on computing chips which can be found in datacenter servers, of key markets, such as cloud computing, enterprise digitalization, social and media, AI training and AI inference. This report provides a scenario for computing in this dynamic market and presents an understanding of the impact of both high-level workloads, including AI and HPC, and massive volume tasks such as video streaming. Including market trends and forecasts, supply chain, technology trends, technical insights and analysis, take away and outlook, this study also delivers an in-depth understanding of the ecosystem and main players’ strategies.

What are the economic and technological challenges of the computing for datacenter industry? What are the key drivers? Who are the suppliers to watch, and what innovative technologies are they working on? What are the impacts of technology transition in datacenter business such as 5G or rising constraints such as power consumption?

Yole presents today its vision of the computing for datacenter servers industry.

As analyzed by Yole’s team in the new Computing for Datacenter Servers 2021 report, from one side the share of specialized chips such as GPU, PLP and accelerators is increasing, and from another side more and more units are integrated into a single chip to address more workloads. Artificial Intelligence algorithms are driving both of these trends, with dedicated accelerators but also and dedicated units integrated into each type of chip.

Dedicating the computing to a specific type of algorithm through faster and more energy-efficient chips is a central trend, which is leading either to the use of dedicated chips such as FPGAs and accelerators or to the integration of specialized units into other chips.

On the one hand, the IC datacenter server market has been boosted by large-volume demand with the digitalization of companies, an existing trend which was boosted even more by COVID-19, as well as by consumer applications, such as social networks and media applications.

According to Adrien Sanchez from Yole: “These two data-intensive applications rely heavily on video streaming which requires intensive computing capabilities, while they also put pressure on bandwidth. This is leading progressively to a new network organization which is less centralized and closer to the edge”.

On the other hand, high-end applications using HPC and the spread of AI in every vertical are requiring more and more capabilities. And today most of the AI training and a still important portion of AI inferences are done in large datacenters. Yole’s analysts expect the associated revenues will grow with a CAGR of more than 10% in the coming years, reaching a total of US$33 billion in 2025.

All year long, Yole Développement publishes numerous reports and monitors. In addition, experts realize various key presentations and organize key conferences. Throughout the year, discover the numerous battery-related reports. Make sure to be aware of the latest news coming from the industry and get an overview of our activities, including interviews with leading companies and more on i-Micronews. Stay tuned!

Extracted from: Computing for Datacenter Servers 2021, Yole Développement

Acronyms

AI: Artificial Intelligence
HPC: High-Performance-Computing
SoC: System on a Chip
CAGR : Compound Annual Growth Rate
CPU: Central Processing Unit
GPU: Graphics Processing Unit
PLP: Programmable Logic Processors
FPGA: Field-Programmable Gate Array
IC: Integrated Circuit

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"Safer and More Efficient Intersections with Computer Vision,” a Presentation from Cubic ...

Fri, 15 Jan 2021 09:00:41 GMT

Jeff Price, Vice President and General Manager at Cubic | GRIDSMART, presents the “Safer and More Efficient Intersections with Computer Vision” tutorial at the September 2020 Embedded Vision Summit. GRIDSMART is an edge computer vision system that uses omnidirectional imaging to detect and track objects through intersections to optimize traffic…

“Safer and More Efficient Intersections with Computer Vision,” a Presentation from Cubic | GRIDSMART

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Chips&Media Adds Extraordinary Features in Next-Generation Video Codec IP: Introducing the ...

Thu, 14 Jan 2021 12:00:37 GMT

SEOUL, Jan 14, 2021 – Chips&Media, a global leading semiconductor HW IP provider that specializes in video codec, image signal processing, and computer vision, today shared its rolled-out product list for the next-generation video codec IPs, the WAVE6 series. Chips&Media is supposedly planning to boost supported architecture and features by changing from frame pipeline to more advanced on-the-fly architecture to deliver ultra-low latency while providing maximum efficiencies through the product lines from the WAVE6 series. Chips&Media’s proprietary buffer compression technology, cFrame, is embedded within the WAVE6 series; therefore, it saves up to 50% of the bandwidth access to memory. The WAVE6 series is suitable for applications including ultra-high-definition televisions(UHDTVs), set-top boxes(STBs), and VR·ARs, smartphones, tablets, camcorders, cameras, and others with super-high resolution across various applications.

The new WAVE6 series provides:

Ultra-low latency
Saving bandwidth and memory footprint by preserving external memory bandwidth for write and read and low external memory buffer required for storing.
Area saving with improved HW Engine architecture.
Simple architecture with reduced firmware complexity and easy to debug and implement customized features.

The new WAVE6 series consists of the following IPs:
The below IPs’ availabilities are differ based on the release schedule.

WAVE627: Encoder IP, supporting HEVC/H.265, AVC/H.264, AV1; targeting 4Kp60 @500MHz
WAVE637: Codec IP, supporting HEVC/H.265, AVC/H.264, AV1; targeting 4Kp60 @500MHz
WAVE618: Decoder IP, supporting VVC; targeting 4Kp60 @500MHz
WAVE638: Codec IP, supporting VVC; targeting 4Kp60 @500MHz
WAVE617: Decoder IP, supporting HEVC/H.265, AVC/H.264, AV1; targeting 4Kp60 @500MHz
WAVE677: Codec IP, supporting HEVC/H.265, AVC/H.264, AV1; targeting dual-CORE 8Kp60@1GHz for HEVC/H.265 and AV1, and single-CORE 4Kp120 @1GHz for AVC/H.264
WAVE658: Decoder IP, supporting VVC; targeting dual-CORE 8Kp60 @1GHz for VVC
WAVE678: Codec IP, supporting VVC; targeting dual-CORE 8Kp60 @1GHz for VVC

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"CMOS Image Sensors: A Guide to Building the Eyes of a Vision System,” a Presentation ...

Thu, 14 Jan 2021 09:00:41 GMT

Jon Stern, Director of Optical Systems at GoPro, presents the “CMOS Image Sensors: A Guide to Building the Eyes of a Vision System” tutorial at the September 2020 Embedded Vision Summit. Improvements in CMOS image sensors have been instrumental in lowering barriers for embedding vision into a broad range of…

“CMOS Image Sensors: A Guide to Building the Eyes of a Vision System,” a Presentation from GoPro

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Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO

Wed, 13 Jan 2021 15:36:06 GMT

News Highlights:

Bob Swan will remain in CEO role until February 15
Intel expects to exceed its previously communicated guidance for fourth-quarter 2020 revenue and earnings per share (EPS). Full fourth-quarter results will be released Jan. 21, 2021, as scheduled.
The company has made strong progress on its 7nm process technology and will provide an update on its Jan. 21 earnings call.

SANTA CLARA, Calif., Jan. 13, 2021 – Intel today announced that its board of directors has appointed 40-year technology industry leader Pat Gelsinger as its new chief executive officer, effective Feb. 15, 2021. Gelsinger will also join the Intel board of directors upon assuming the role. He will succeed Bob Swan, who will remain CEO until Feb. 15.

Today’s announcement is unrelated to Intel’s 2020 financial performance. Intel expects its fourth-quarter 2020 revenue and EPS to exceed its prior guidance provided on Oct. 22, 2020. In addition, the company has made strong progress on its 7nm process technology and plans on providing an update when it reports its full fourth-quarter and full-year 2020 results as previously scheduled on Jan. 21, 2021.

More: Note from Pat Gelsinger to Intel

Gelsinger is a highly respected CEO and industry veteran with more than four decades of technology and leadership experience, including 30 years at Intel where he began his career.

“Pat is a proven technology leader with a distinguished track record of innovation, talent development, and a deep knowledge of Intel. He will continue a values-based cultural leadership approach with a hyper focus on operational execution,” said Omar Ishrak, independent chairman of the Intel board. “After careful consideration, the board concluded that now is the right time to make this leadership change to draw on Pat’s technology and engineering expertise during this critical period of transformation at Intel. The board is confident that Pat, together with the rest of the leadership team, will ensure strong execution of Intel’s strategy to build on its product leadership and take advantage of the significant opportunities ahead as it continues to transform from a CPU to a multi-architecture XPU company.”

“I am thrilled to rejoin and lead Intel forward at this important time for the company, our industry and our nation,” said Gelsinger. “Having begun my career at Intel and learned at the feet of Grove, Noyce and Moore, it’s my privilege and honor to return in this leadership capacity. I have tremendous regard for the company’s rich history and powerful technologies that have created the world’s digital infrastructure. I believe Intel has significant potential to continue to reshape the future of technology and look forward to working with the incredibly talented global Intel team to accelerate innovation and create value for our customers and shareholders.”

“The board and I deeply appreciate Bob Swan for his leadership and significant contributions through this period of transformation for Intel,” continued Ishrak. “Under his leadership, Intel has made significant progress on its strategy to transform into a multi-architecture XPU company to capitalize on market shifts and extend Intel’s reach into fast-growing markets. Bob has also been instrumental in reenergizing the company’s culture to drive better execution of our product and innovation roadmap. He leaves Intel in a strong strategic and financial position, and we thank him for his ongoing guidance as he works with Pat to ensure the leadership transition is seamless.”

“My goal over the past two years has been to position Intel for a new era of distributed intelligence, improving execution to strengthen our core CPU franchise and extending our reach to accelerate growth,” said Swan. “With significant progress made across those priorities, we’re now at the right juncture to make this transition to the next leader of Intel. I am fully supportive of the board’s selection of Pat and have great confidence that, under his leadership and the rest of the management team, Intel will continue to lead the market as one of the world’s most influential technology companies.”

Most recently, Gelsinger served as the CEO of VMware since 2012, where he significantly transformed the company into a recognized global leader in cloud infrastructure, enterprise mobility and cyber security, almost tripling the company’s annual revenues. Prior to joining VMware, Gelsinger was president and chief operating officer of EMC Information Infrastructure Products at EMC, overseeing engineering and operations for information storage, data computing, backup and recovery, RSA security and enterprise solutions. Before joining EMC, he spent 30 years at Intel, becoming the company’s first chief technology officer and driving the creation of key industry technologies such as USB and Wi-Fi. He was the architect of the original 80486 processor, led 14 different microprocessor programs and played key roles in the Core and Xeon families.

About Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Qualcomm to Acquire NUVIA

Wed, 13 Jan 2021 14:58:33 GMT

Augmenting its leading technology roadmap to redefine computing performance
Accelerating successful partnerships with OS providers for next-generation computing devices
Enabling Samsung and the mobile ecosystem to redefine premium performance for smartphones
Leading CPU talent to join Qualcomm’s best in class innovation culture

Jan 13, 2021 – SAN DIEGO – Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has entered into a definitive agreement to acquire NUVIA for approximately $1.4 billion before working capital and other adjustments. The transaction is subject to customary closing conditions, including regulatory approval under the Hart-Scott-Rodino Antitrust Improvements Act of 1976, as amended.

5G is further accelerating the convergence of mobility and computing. The acquisition of NUVIA builds on Qualcomm Technologies’ Snapdragon technology leadership, delivering step-function improvements in CPU performance and power efficiency to meet the demands of next-generation 5G computing.

NUVIA comprises a proven world-class CPU and technology design team, with industry-leading expertise in high performance processors, Systems on a Chip (SoC) and power management for compute-intensive devices and applications. The addition of NUVIA CPUs to Qualcomm Technologies’ already leading mobile graphics processing unit (GPU), AI engine, DSP and dedicated multimedia accelerators will further extend the leadership of Qualcomm Snapdragon platforms, and positions Snapdragon as the preferred platform for the future of connected computing.

NUVIA CPUs are expected to be integrated across Qualcomm Technologies’ broad portfolio of products, powering flagship smartphones, next-generation laptops, and digital cockpits, as well as Advanced Driver Assistance Systems, extended reality and infrastructure networking solutions.

“5G, the convergence of computing and mobile architectures, and the expansion of mobile technologies into other industries are significant opportunities for Qualcomm,” said Cristiano Amon, President and CEO-Elect, Qualcomm Incorporated. “The NUVIA team are proven innovators, and like Qualcomm, have a strong heritage in creating leading technology and products. I am very excited to have them join our team. Together, we are very well positioned to redefine computing and enable our ecosystem of partners to drive innovation and deliver a new class of products and experiences for the 5G era.”

“Creating high performance, low-power processors and highly integrated, complex SoCs are part of our DNA,” said Jim Thompson, Chief Technology Officer of Qualcomm. “Adding NUVIA’s deep understanding of high-performance design and integrating NUVIA CPUs with Snapdragon – together with our industry-leading graphics and AI – will take computing performance to a new level and drive new capabilities for products that serve multiple industries.”

As part of the transaction, NUVIA founders Gerard Williams III, Manu Gulati and John Bruno, and their employees will be joining Qualcomm.

“CPU performance leadership will be critical in defining and delivering on the next era of computing innovation,” said Gerard Williams CEO of NUVIA. “The combination of NUVIA and Qualcomm will bring the industry’s best engineering talent, technology and resources together to create a new class of high-performance computing platforms that set the bar for our industry. We couldn’t be more excited for the opportunities ahead.”

Qualcomm’s broad ecosystem of partners have voiced strong support for this acquisition:

Microsoft: “It’s exciting to see NUVIA join the Qualcomm team. Our partnership with Qualcomm has always been about providing great experiences on our products. Moving forward, we have an incredible opportunity to empower our customers across the Windows ecosystem,” said Panos Panay, Chief Product Officer, Microsoft.

Google: “Compute performance, connectivity and power efficiency are critical ingredients that make the billions of Android and Chrome OS devices shine,” said Hiroshi Lockheimer, SVP Platforms & Ecosystems, Google. “The addition of NUVIA extends Qualcomm’s capabilities in these three areas and we’re excited to see the next generation of Snapdragon with NUVIA.”

Samsung: “With NUVIA joining the Qualcomm team, we look forward to continuing to innovate and building incredible experiences together. Qualcomm’s commitment to platform technology will help us offer the premium smartphone performance to our users around the world,” said TM Roh, President and Head of Mobile Communications Business, Samsung Electronics.

Acer: “Together with Qualcomm we have delivered a new generation of thin and light always connected PCs and Chromebooks. The acquisition of NUVIA will enable Qualcomm to continue to advance Snapdragon’s industry leadership and help Acer to continue to innovate and bring high performance, 5G connected devices to our customers globally,” said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc.

ASUS: “We have had the pleasure of collaborating with Qualcomm for many years to deliver premium smartphones, such as our flagship ROG Phone for gaming, as well as PCs powered by the exceptional performance and connectivity of Snapdragon platforms. We are excited for the future of our partnership as Qualcomm advances and expands its portfolio and capabilities with the addition of NUVIA,” said S.Y. Hsu, co-CEO of ASUS.

Bosch: “The automotive industry is evolving at an unprecedented pace of innovation. Bosch considers the adoption of new in-vehicle services and capabilities as one major driver for growth. Qualcomm is a strong partner to us. We see the need for high performance, power efficient platforms and appreciate Qualcomm’s ambition to push the boundaries of innovation even further,” said Dr. Andree Zahir, SVP for Infotainment and Connectivity, Bosch.

Continental: “Continental looks forward to the addition of NUVIA as we continue to partner with Qualcomm in bringing advanced capabilities to next generation vehicles,” said Peter Popp as head of purchasing, Vehicle Networking and Information, Continental.

General Motors: “We look forward to NUVIA joining the Qualcomm team as we continue to work together to deliver advanced in-vehicle services and technologies for the customers of our next-generation vehicles,” said Dan Nicholson, VP, Global Electrification, Controls, SW ＆ Electronics at General Motors.

HMD: “Qualcomm has always been a best-in-class partner globally and our ongoing collaboration has enabled HMD to bring unique mobile device innovation to the market and deliver on the Nokia brand promise of being trusted, always secure and built to last. We are excited for the NUVIA team to join Qualcomm and congratulate the company on its commitment to ensure Snapdragon continues to be the industry’s leading mobile platform,” said Florian Seiche CEO, HMD.

Honor: “As a new, independent company committed to bringing breakthrough mobile experiences to consumers, we are pleased to see that Qualcomm will acquire NUVIA, enabling them to continue to lead in developing and delivering premium performance Snapdragon mobile platforms to the market,” said Biao Wan, Chairman, Honor Device Co Ltd.

HP: “HP and Qualcomm have been strong partners in addressing the needs of our mutual Personal Systems customers, most recently on the Elite Folio, the world’s first pull-forward business convertible, launched at CES,” said Alex Cho, president of Personal Systems, HP Inc. “The PC is more essential than ever, and we’re excited to see the industry and Qualcomm invest in innovation to support the needs of the 5G world.”

Lenovo: “With Qualcomm we delivered the world’s first 5G connected PC. As we look to create the advanced capabilities PC users demand, we are excited that the world class CPU development team from NUVIA is joining Qualcomm and we look forward to continuing to work together to deliver breakthrough PC experiences to users across the globe,” said Gianfranco Lanci, President and COO, Lenovo.

LG Electronics: “The automotive industry is evolving at an accelerated pace of innovation driven by the adoption of new in-vehicle services and capabilities powered by technology partners like Qualcomm. The addition of the NUVIA team will enable Qualcomm to continue to consolidate compute and connectivity ECUs into high performance, power efficient platforms to push the boundaries of innovation even further,” Jin-Yong Kim, President of Vehicle components Solutions (VS) Company, LG Electronics Inc.

LG Mobile: “Congratulations to Qualcomm and NUVIA for joining forces to create a new breed of platforms that will push the envelope on compute performance and connectivity,” said Morris Lee, President LG Mobile.

OnePlus: “We are excited to hear Qualcomm will be extending their industry leading Snapdragon mobile platform leadership by acquiring the world class CPU team at NUVIA. OnePlus fans will also be excited to see what innovation and new premium experiences we can deliver on new flagship One Plus devices powered by future generations of Snapdragon mobile platforms,” said Pete Lau, Founder and CEO, OnePlus.

OPPO: “With NUVIA joining the Qualcomm team, we look forward to continue innovating together and building incredible devices powered by the Snapdragon mobile platforms. Qualcomm’s commitment to platform leadership will enable us to deliver innovative new products and experiences for OPPO smartphone users around the world,” said Tony Chen, Founder and CEO, OPPO.

Panasonic: “Innovation in the automotive market is occurring at an accelerated pace. We welcome the addition of the world class NUVIA team to Qualcomm and look forward to the continued partnership,” said Masashige Mizuyama, Chief Technology Officer, Automotive Company, Panasonic Corporation

Renault: “The automotive industry is the new frontier exploiting the benefits of mobile technology innovations in high performance compute and connectivity and Qualcomm has always been at the forefront. The addition of NUVIA is welcomed as we continue to work with Qualcomm to deliver world class in-vehicle services and experiences,” said Thierry Cammal, Alliance Global Vice President Software Factory.

Sharp: “With Qualcomm’s expertise and leading technologies, we have been able to deliver cutting edge devices and premium mobile experiences and we welcome the addition of NUVIA to extend Qualcomm’s leadership and enhance their capabilities,” said Shigeru Kobayashi GM, Sharp Personal Communications Group.

Sony: “We have enjoyed a great collaboration with Qualcomm for many years and are excited to hear the NUVIA team will be joining Qualcomm. As a leader in delivering amazing camera and gaming experiences on mobile devices we understand that to continue to lead will require the next generation high performance & low power computing and connectivity solutions that only Snapdragon platforms can deliver,” said Mitsuya Kishida President, Sony Mobile Communications Inc.

VIVO: “Qualcomm’s Snapdragon platforms power millions of VIVO phones across the globe today, and the addition of NUVIA will help Qualcomm continue to lead, delivering the ultimate in high performance compute, lightning fast 5G connectivity and industry leading power efficiency,” said Shen Wei, CEO, VIVO.

Xiaomi: “Xiaomi and Qualcomm have partnered for over a decade to deliver world class premium mobile experiences to millions of people. The addition of NUVIA will extend Qualcomm’s Snapdragon platforms industry leadership helping Xiaomi to continue to bring innovation and next level premium mobile experiences to Mi fans around the world,” said Lei Jun, Chairman and CEO, Xiaomi.

About Qualcomm

Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.

About NUVIA Inc.

Headquartered in Santa Clara, NUVIA was founded on the promise of reimagining silicon design for high-performance computing environments. The company is focused on building products that blend the best attributes of compute performance, power-efficiency and scalability. For more information please visit www.nuviainc.com.

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January 13, 2021 Edge AI and Vision Alliance Member Briefing

Wed, 13 Jan 2021 12:56:59 GMT

The PDF file linked to below is the presentation from the January 13, 2021 Edge AI and Vision Alliance Member Briefing. Please be aware that these materials are for Alliance Member company internal use only. January 13, 2021 Edge AI and Vision Alliance Member Briefing

January 13, 2021 Edge AI and Vision Alliance Member Briefing

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Edge AI and Vision Insights: January 13, 2021 Edition

Wed, 13 Jan 2021 09:01:59 GMT

LETTER FROM THE EDITOR

Dear Colleague,

The 100% virtual 2021 Embedded Vision Summit, the premier conference for innovators adding computer vision and visual AI to products, is coming May 25-27—and we’re excited about the program that’s taking shape! At the Summit, you’ll be able to:

See an amazing range of technology in action—we’re talking dozens upon dozens of leading-edge building-block technologies as well as applications enabled with computer vision, edge AI, and sensor data
Watch expert sessions on the most pressing topics in the industry from some of the brightest minds currently working with edge AI and vision
Connect with those VEPs—you know, Very Elusive People—like that potential building-block technology supplier, critical ecosystem partner, or technical expert you’ve been looking for
Keep building your skills with hands-on learning, tutorials and more!

Learn more and then register today with promo code SUPEREARLYBIRD21 to receive your 25%-off Super Early Bird Discount!

Also, consider presenting at the Summit. Speaking is a great opportunity to:

Share your expertise on practical computer vision and visual AI and be recognized as an authority on the subject by your peers
Increase your company’s visibility and reputation
Build your network and connect with new suppliers, customers and partners

Session proposals are due by February 3. Space is limited, so submit your proposal now before the agenda fills up. Visit the Summit website to learn more about the requirements, and to submit your proposal.

The Alliance is now accepting applications for the sixth annual Vision Tank start-up competition. Are you an early-stage start-up company developing a new product or service incorporating or enabling computer vision or visual AI? Do you want to raise awareness of your company and products with vision industry experts, investors and developers? The Vision Tank start-up competition offers early-stage companies a chance to present their new products to a panel of judges at the 2021 Embedded Vision Summit, in front of a live online audience.

Two awards are given out each year: the Judges’ Award and the Audience Choice Award. The winner of the Vision Tank Judges’ Award will receive a $5,000 cash prize, and both winners will receive a one-year membership in the Edge AI and Vision Alliance. All finalists will also get one-on-one advice from the judges, as well as valuable introductions to potential investors, customers, employees and suppliers. Applications are due by February 17; for more information, and to enter, please see the program page.

Brian Dipert
Editor-In-Chief, Edge AI and Vision Alliance

ASSESSING DEEP LEARNING ACCURACY

Accuracy: Beware of Red Herrings and Black Swans
Machine learning aims to construct models that are predictive: accurate even on data not used during training. But how should we assess accuracy? How can we avoid catastrophic errors due to black swans—rare, highly atypical events? Consider that, at 30 frames per second, video presents so many events that even “highly atypical” ones occur every day! How can we avoid overreacting to red herrings—coincidences in the training data that are irrelevant? After all, a model’s entire knowledge of the world is the data used in training. To build more trustworthy models, we must re-examine how to measure accuracy and how best to achieve it. This talk from Steve Teig, CEO of Perceive, challenges some widely held assumptions and offers some novel steps forward, occasionally livened by colorful, zoological metaphors.

Machine Learning for the Real World: What is Acceptable Accuracy, and How Can You Achieve It?
The benefits of running machine learning at the edge are widely accepted, and today’s low-power edge devices are already showing great potential to run ML. But what constitutes acceptable accuracy when applied to real-world, real-time use cases? In this talk, Tim Hartley, Director of Product and Marketing at Arm, explores what constitutes acceptable detection accuracy for specific use cases, and how this can be measured. Looking at which ML models are meeting the challenges and which fall short, he focuses on how techniques like transfer learning can help fill the gaps when weaknesses in detection accuracy are found.

PROCESSING AT THE EDGE

Trends in Neural Network Topologies for Vision at the Edge
The widespread adoption of deep neural networks (DNNs) in embedded vision applications has increased the importance of creating DNN topologies that maximize accuracy while minimizing computation and memory requirements. This has led to accelerated innovation in DNN topologies. In this talk, Pierre Paulin, Director of R&D for Embedded Vision at Synopsys, summarizes the key trends in neural network topologies for embedded vision applications, highlighting techniques employed by widely used networks such as EfficientNet and MobileNet to boost both accuracy and efficiency. He also touches on other optimization methods—such as pruning, compression and layer fusion—that developers can use to further reduce the memory and computation demands of modern DNNs.

Making Edge AI Inference Programming Easier and Flexible
Deploying an AI model at the edge doesn’t have to be challenging—but it often is. Embedded processing vendors have unique sets of software tools for deploying models. It takes time and investment to learn to use proprietary tools and to optimize the edge implementation to achieve your desired performance. While embedded vendors are providing proprietary tools for model deployment, the open source community is also advancing to standardize the model deployment process and make it hardware agnostic. Texas Instruments has adopted open source software frameworks to make model deployment easier and more flexible. In this talk from product marketing engineer Manisha Agrawal, you will learn about the struggles developers face when deploying models for inference on embedded processors and how TI addresses these critical software development challenges. You will also discover how TI enables faster time-to-market using a flexible open source development approach without the need to compromise performance, accuracy or power requirements.

UPCOMING INDUSTRY EVENTS

Horizon Robotics Webinar – Advancing the AI Processing Architecture for the Software-Defined Car: January 21, 2021, 9:00 am PT

Edge AI and Vision Alliance Webinar – Adding Visual AI or Computer Vision to Your Embedded System: Key Things Every Engineering Manager Should Know: February 9, 2021, 9:00 am PT

Vision Components Webinar – Adding Embedded Cameras to Your Next Industrial Product Design: February 16, 2021, 9:00 am PT

Edge Impulse Webinar – How to Rapidly Build Robust Data-driven Embedded Machine Learning Applications: February 25, 2021, 9:00 am PT

More Events

"Deep Learning on Mobile Devices,” a Presentation from Siddha Ganju

Wed, 13 Jan 2021 09:00:51 GMT

Independent AI architect Siddha Ganju presents the “Deep Learning on Mobile Devices” tutorial at the September 2020 Embedded Vision Summit. Over the last few years, convolutional neural networks (CNNs) have grown enormously in popularity, especially for computer vision. Many applications running on smartphones and wearable devices could benefit from the…

“Deep Learning on Mobile Devices,” a Presentation from Siddha Ganju

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Arm’s Powerful Compute and Graphics Platform at the Heart of the New Samsung Exynos 2100

Wed, 13 Jan 2021 01:51:05 GMT

News highlights:

Arm’s next-generation mobile solution is powering the new Samsung Exynos 2100 SoC, an early adopter of the new Arm Cortex-X1 CPU in a tri-cluster, octa-core configuration, and optimized for 5nm
Delivering over 30% multi-tasking performance improvement and exceptional battery life to take premium smartphone experiences to the next level
Partnership highlights technology innovation and shared vision for pushing the boundaries of mobile

Last year, Arm launched its latest mobile solution, providing partners with greater performance and efficiency, combined with security and system improvements across the entire system-on-chip (SoC). Leveraging a Total Compute approach meant improved real-world use cases on mobile, offering end-users higher quality experiences, and developers the ability to create enhanced applications for the 5G era.

Today, this technology has become a reality on silicon, with Arm’s next-generation mobile solution at the heart of the newly announced Exynos 2100. The new SoC adopts the powerful Arm Cortex-X1 CPU in a tri-cluster octa-core configuration alongside the Arm Cortex-A78 CPU, as well as the Arm Mali-G78 GPU, and optimized for 5nm to support faster, better, and longer mobile experiences. Arm’s longstanding partnership with Samsung Electronics’ System LSI business demonstrates how technological innovation, and a shared vision for pushing the boundaries of mobile, can make new mobile experiences a reality.

The octa-core CPU configuration

The Cortex-X1 is Arm’s most powerful CPU to date and the first from the Cortex-X Custom (CXC) program. It gives our partners greater flexibility and scalability to increase peak performance relative to our standard CPUs. While the Cortex-X1 is all about maximum performance, the Cortex-A78 is our most efficient CPU ever designed for mobile.

The Exynos 2100’s tri-cluster octa-core CPU configuration combines a Cortex-X1 core, alongside 3x Cortex-A78 and 4x Cortex-A55, to deliver improvements of nearly 30 percent in multi-core performance compared to its predecessor. For the user, this means a faster user interface and greater responsiveness when launching and running applications.

A leap forward in graphics performance

Alongside this powerful octa-core CPU configuration, is the Mali-G78 GPU which represents Arm’s most performant GPU to-date, delivering outstanding graphics and all-day gaming. Combining the performance benefits of the Cortex CPU cores and Mali-G78 with the rapid speeds, low latency, and high bandwidth of 5G will enable advanced gaming experiences on mobile.

Mali-G78 enables the Exynos 2100 to improve graphics performance over its predecessor by more than 40 percent. This means more visually stunning and seamless graphics and more immersive on-screen mobile entertainment experiences, such as high-fidelity premium gaming and XR (virtual reality and augmented reality) experiences.

Bringing new experiences to your mobile

For the end-user, the Exynos 2100 will enable uncompromised performance and exceptional battery life. Users will be able to enjoy better experiences on their smartphones for far longer while they are ‘on-the-go.’

Arm is committed to enabling secure, digital immersion for the 5G era on consumer devices and today’s announcement is evidence of this as we see the Cortex-X1 CPU in silicon, maximizing smartphone performance. And of course, we could not do this without great partners like Samsung and their leading-edge Exynos SoCs designed to accelerate our premium smartphone and 5G experiences.

Ian Smythe
Vice President of Marketing, Client Line of Business, Arm

About Arm

Arm technology is at the heart of a computing and data revolution that is transforming the way people live and businesses operate. Our energy-efficient processor designs and software platforms have enabled advanced computing in 180 billion chips and our technologies securely power products from the sensor to the smartphone and the supercomputer. Together with 1,000+ technology partners we are at the forefront of designing, securing and managing all areas of AI-enhanced connected compute from the chip to the cloud.

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NVIDIA Ampere Architecture Powers Record 70+ New GeForce RTX Laptops

Tue, 12 Jan 2021 22:27:50 GMT

GeForce RTX 30 Series Laptop GPUs Offer Up to 2x Efficiency, 3rd Gen Max-Q Technology, Start at $999

Tuesday, January 12, 2021 – A new era of laptops begins today featuring the NVIDIA Ampere architecture, with the launch of 70+ models powered by GeForce^® RTX 30 Series Laptop GPUs.

These next-gen laptops, which start at $999, increase energy efficiency by up to 2x, accelerate performance dramatically and introduce third-generation Max-Q technologies for thin and lightweight designs.

The new RTX 30 Series Laptop GPUs deliver stunning ray-traced gaming experiences in Cyberpunk 2077 and other top titles, and enable content creators to produce incredible work using hundreds of GPU-accelerated apps.

“After taking the desktop market by storm, our NVIDIA Ampere architecture is now powering the world’s fastest laptops,” said Kaustubh Sanghani, vice president and general manager of GeForce OEM at NVIDIA. “Nowhere does power efficiency matter more than in gaming laptops, a market that’s grown 7x in the past seven years. These new thin and light systems are based on our Max-Q technologies, where every aspect — CPU, GPU, software, PCB design, power delivery, thermals — is optimized for power and performance.”

Global availability starts later this month with GeForce RTX gaming and creator laptops featuring GeForce RTX 3080 and GeForce RTX 3070 Laptop GPUs, followed by laptops with the GeForce RTX 3060 Laptop GPU.

GeForce RTX 3060 delivers 90 frames per second on the latest games with ultra settings at 1080p. RTX 3060 laptops start at $999 and are faster than laptops featuring NVIDIA’s previous flagship GPU, GeForce RTX 2080 SUPER, which typically sell for $2,500.
GeForce RTX 3070 is a 1440p gaming beast, delivering 90 frames per second with ultra settings at 1440p. RTX 3070 laptops start at $1,299 and are 50 percent faster than those equipped with the RTX 2070.
GeForce RTX 3080 is NVIDIA’s new flagship laptop GPU. With up to 16GB of G6 memory, it powers the world’s fastest laptops for gamers and creators. It delivers 100+ frames per second with ultra settings at 1440p. Systems featuring the RTX 3080 start at $1,999.

Third-Gen Max-Q Tech Delivers Optimal Power and Performance

The third generation of Max-Q technologies uses AI and new system optimizations to make high-performance gaming laptops faster and better than ever. These include:

Dynamic Boost 2.0: Traditionally, gaming laptops set the power for the CPU and GPU. Yet, games and creative apps are dynamic, and demands on the system change from frame to frame. With Dynamic Boost 2.0, AI networks balance the power between the CPU, GPU and now, GPU memory, depending on where it is needed the most — constantly optimizing for maximum performance.
WhisperMode 2.0: Delivering a new level of acoustic control for gaming laptops, WhisperMode has been reengineered from the ground up and is custom built into each laptop. Once the desired acoustics are selected, WhisperMode 2.0’s AI-powered algorithms manage the CPU, GPU, system temperatures and fan speeds to deliver great acoustics at the best possible performance.
Resizable BAR: This advanced PCI Express technology enables all of the GPU memory to be accessed by the CPU at once, providing a performance boost in many games.
NVIDIA DLSS: NVIDIA Deep Learning Super Sampling uses AI and RTX Tensor Cores to deliver up to 2x the performance at the same power. For a single 1440 frame, a GPU needs to calculate almost 4 million pixels. NVIDIA DLSS requires only a fraction of the pixels, which improves efficiency and increases performance.

Award-Winning NVIDIA Ampere Architecture, Plus New Ways to Play

The new laptop GPUs feature NVIDIA Ampere architecture streaming multiprocessors, which offer 2x FP32 throughput, delivering vastly improved performance with improved performance per watt. These include new dedicated RT Cores delivering 2x the throughput of the previous generation, and new third-generation Tensor Cores, with up to 2x the throughput of their predecessors, to power NVIDIA DLSS, which accelerates performance.

The new laptops also include new tools for gamers and creators, including NVIDIA Broadcast, which harnesses AI to turn any room into a home broadcast studio; NVIDIA Reflex, which makes competitive games quicker; GeForce Experience, to capture and share videos, screenshots and livestreams with friends; and NVIDIA Studio, for acceleration and optimization of demanding creator apps.

Esports Laptops Play at 240+ FPS

Nearly three-quarters of laptop gamers play esports, spurring the popularity of high-refresh-rate laptops, sales of which doubled last year. Over half of the new GeForce RTX 30 Series laptops will offer 240Hz or higher refresh rates.

With the performance of the GeForce RTX 3080 Laptop GPU, gamers will be able to play at 240 frames per second across top titles like Overwatch, Rainbow Six, Valorant and Fortnite. And with NVIDIA Reflex, gamers can achieve sub-20ms system latency, enabling them to play their absolute best.

GeForce RTX 30 Series Studio Laptops

With the help of the NVIDIA Ampere architecture, rendering on Studio laptops is now up to twice as fast as the previous generation and up to 30x faster than CPU. Video editors can work with 8K RAW footage, use AI to simplify workflows and reduce encode times by up to 75 percent. Artists can take advantage of up to 16GB of graphics memory to work with huge assets or multiple apps simultaneously.

Using new third-generation Max-Q technologies, OEM partners ASUS, Gigabyte, MSI and Razer are launching new NVIDIA Studio laptops with the new GeForce RTX 30 Series Laptop GPUs.

Availability

GeForce RTX 30 Series laptops will be available starting Jan. 26 from the world’s top OEMs, including Acer, Alienware, ASUS, Gigabyte, HP, Lenovo, MSI and Razer. They will also be available from local OEMs and system builders, including Aftershock, CyberPower PC, Digital Storm, Eluktronics, Falcon NW, Hasee, Maingear, Mechrevo, Mouse, Origin PC, PC Specialist, Scan, Schenker, Terrans Force and Thunderobot, XOTIC PC. Pricing, configurations and availability will vary among regions and partners.

Press assets, including product photographs, specifications, chip and die shots and other materials, are available on the NVIDIA press site at www.nvidia-press.com.

About NVIDIA

NVIDIA’s (NASDAQ: NVDA) invention of the GPU in 1999 sparked the growth of the PC gaming market and has redefined modern computer graphics, high performance computing and artificial intelligence. The company’s pioneering work in accelerated computing and AI is reshaping trillion-dollar industries, such as transportation, healthcare and manufacturing, and fueling the growth of many others. More information at https://nvidianews.nvidia.com/.

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NVIDIA Introduces GeForce RTX 3060, Next Generation of the World’s Most Popular GPU

Tue, 12 Jan 2021 22:21:48 GMT

Powered by NVIDIA Ampere Architecture, Delivers Up to 10x the Ray-Tracing Performance of GTX 1060; Starting at $329

Tuesday, January 12, 2021 – NVIDIA today announced that it is bringing the NVIDIA Ampere architecture to millions more PC gamers with the new GeForce^® RTX 3060 GPU.

With its efficient, high-performance architecture and the second generation of NVIDIA RTX, the RTX 3060 brings amazing hardware ray-tracing capabilities and support for NVIDIA DLSS and other technologies, and is priced at $329.

NVIDIA’s 60-class GPUs have traditionally been the single most popular cards for gamers on Steam, with the GTX 1060 long at the top of the GPU gaming charts since its introduction in 2016. An estimated 90 percent of GeForce gamers currently play with a GTX-class GPU.

“There’s unstoppable momentum behind ray tracing, which has quickly redefined the new standard of gaming,” said Matt Wuebbling, vice president of global GeForce marketing at NVIDIA. “The NVIDIA Ampere architecture has been our fastest-selling ever, and the RTX 3060 brings the strengths of the RTX 30 Series to millions more gamers everywhere.”

With newer gaming titles come bigger worlds with cinematic graphics and real-time ray tracing — these are gaming workloads that only RTX-powered platforms are suited to handle. The GeForce RTX 3060 has twice the raster performance and 10x the ray-tracing performance of the GTX 1060, making it a formidable upgrade opportunity and the foundation of a gaming PC platform powerful enough to handle cutting-edge titles such as Cyberpunk 2077 and Fortnite with RTX On at 60 frames per second.

The RTX 3060’s key specifications include:

13 shader-TFLOPs
25 RT-TFLOPs for ray tracing
101 tensor-TFLOPs to power NVIDIA DLSS (Deep Learning Super Sampling)
192-bit memory interface
12GB of GDDR6 memory

Resizable BAR will be supported on the GeForce RTX 30 Series starting with the RTX 3060. When combined with a compatible motherboard, this advanced PCI Express technology enables all of the GPU memory to be accessed by the CPU at once, providing a performance boost in many games.

Like all RTX 30 Series GPUs, the RTX 3060 supports the trifecta of GeForce gaming innovations: NVIDIA DLSS, NVIDIA Reflex and NVIDIA Broadcast, which accelerate performance and enhance image quality. Together with real-time ray tracing, these technologies are the foundation of the GeForce gaming platform, which brings unparalleled performance and features to games and gamers everywhere.

NVIDIA DLSS: The AI Gift That Gamers Love

AI is revolutionizing gaming — from in-game physics and animation simulation to real-time rendering and AI-assisted broadcasting features. Powered by dedicated AI processors on GeForce RTX GPUs called Tensor Cores, NVIDIA DLSS boosts frame rates while generating beautiful, crisp game images and gives gamers the performance headroom to maximize ray-tracing settings and increase output resolutions. DLSS is available in more than 25 games, with more added every month.

NVIDIA Reflex and Broadcast: The Ultimate Play

NVIDIA Reflex technology reduces system latency (or input lag), making games more responsive and giving players in competitive multiplayer titles an edge over the opposition. NVIDIA Broadcast is a suite of audio and video AI enhancements, including virtual backgrounds, motion capture and advanced noise removal, that users can apply to chats, Skype calls and video conferences.

Advanced GeForce Experience Features

All NVIDIA GeForce GPUs benefit from GeForce Experience, a tool used by tens of millions of gamers to optimize game settings, record and upload gameplay, stream gameplay, take screenshots, and download and install Game Ready^® Drivers. The latest features include:

One-click automatic GPU Tuning: GeForce Experience now supports GPU Tuning, which can automatically create overclocking profiles by using an advanced scanning algorithm.
Enhanced in-game monitoring overlay: GeForce Experience’s already robust in-game overlay now adds performance stats, temperatures and latency metrics, including NVIDIA Reflex Latency Analyzer stats.

Where to Buy

The GeForce RTX 3060 will be available in late February, starting at $329, as custom boards — including stock-clocked and factory-overclocked models — from top add-in card providers such as ASUS, Colorful, EVGA, Gainward, Galaxy, Gigabyte, Innovision 3D, MSI, Palit, PNY and Zotac. Look for GeForce RTX 3060 GPUs at major retailers and etailers, as well as in gaming systems by major manufacturers and leading system builders worldwide.

Press assets, including product photographs, specifications, chip and die shots and other materials, are available on the NVIDIA press site at www.nvidia-press.com.

About NVIDIA

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AMD Announces World’s Best Mobile Processors¹ In CES 2021 Keynote

Tue, 12 Jan 2021 22:07:53 GMT

AMD Ryzen Threadripper PRO Processors, designed for the most demanding professional workloads, coming to retail channel

SANTA CLARA, Calif. – 01/12/2021 – Today, AMD (NASDAQ: AMD) announced the full portfolio of AMD Ryzen 5000 Series Mobile Processors, bringing the highly-efficient and extremely powerful “Zen 3” core architecture to the laptop market. New AMD Ryzen 5000 Series Mobile Processors provide unprecedented levels of performance and incredible battery life for gamers, creators, and professionals. New laptops powered by Ryzen 5000 Series Mobile processors will be available from major PC manufacturers including ASUS, HP and Lenovo, starting in Q1 2021. Expanding its leadership client computing product portfolio featuring the “Zen 3” core, AMD also announced the AMD Ryzen PRO 5000 Series Mobile Processors, delivering enterprise-grade security and seamless manageability to commercial users. Throughout the course of 2021, AMD expects a broad portfolio of more than 150 consumer and commercial notebooks based on the Ryzen 5000 Series Mobile Processors.

“As the PC becomes an even more essential part of how we work, play and connect, users demand more performance, security and connectivity,” said Saeid Moshkelani, senior vice president and general manager, Client business unit, AMD. “The new AMD Ryzen 5000 Series Desktop and Mobile Processors bring the best innovation AMD has to offer to consumers and professionals as we continue our commitment to delivering best-in-class experiences with instant responsiveness, incredible battery life and fantastic designs. With our PC partners, we are delivering top-quality performance and no-compromise solutions alongside our record-breaking growth in the notebook and desktop space in the previous year.”

AMD Ryzen 5000 Series Mobile Processors

Building upon the previous generation of leadership mobile processors, the Ryzen 5000 Series includes high-performance H- and ultra-mobile U-Series processors. At the top of the product stack, AMD Ryzen 5000 H-Series Mobile Processors deliver impressive gaming experiences by combining unmatched performance with outstanding battery life, featuring up to 8 cores and 16 threads and built on the new AMD “Zen 3” architecture.

Topping out the mobile processor offering, the HX Series processors provide gamers and creators with elite-level performance while HS processors bring the power of H-Series in thinner and lighter form factors. The new AMD Ryzen 9 5980HX processor is capable of up to 23% increased single-threaded performance and up to 17% faster multi-threaded performance over the previous generation² making it the ideal solution for gaming and creator notebooks.

For mainstream consumers looking for performance on-the-go, the AMD Ryzen 5000 U-Series Mobile Processors offer the perfect blend of performance and efficiency. The new AMD Ryzen 7 5800U processor offers:

Up to 16% more single-threaded performance and up to 14% faster multithreaded performance over the previous generation³
Up to an incredible 17.5 hours of general usage battery life and up to 21 hours of movie playback on a single charge⁴

Product Specification: AMD Ryzen 5000 Series Mobile Processors

Model	Cores/Threads	Boost⁵/Base⁶Frequency (GHz)	Cache (MB)	TDP (Watts)	Architecture
AMD Ryzen 9 5980HX	8C/16T	Up to 4.8 / 3.3 GHz	20	45+	“Zen 3”
AMD Ryzen 9 5980HS	8C/16T	Up to 4.8 / 3.0 GHz	20	35	“Zen 3”
AMD Ryzen 9 5900HX	8C/16T	Up to 4.6 / 3.3 GHz	20	45+	“Zen 3”
AMD Ryzen 9 5900HS	8C/16T	Up to 4.6 / 3.0 GHz	20	35	“Zen 3”
AMD Ryzen 7 5800H	8C/16T	Up to 4.4 / 3.2 GHz	20	45	“Zen 3”
AMD Ryzen 7 5800HS	8C/16T	Up to 4.4 / 2.8 GHz	20	35	“Zen 3”
AMD Ryzen 5 5600H	6C/12T	Up to 4.2 / 3.3 GHz	19	45	“Zen 3”
AMD Ryzen 5 5600HS	6C/12T	Up to 4.2 / 3.0 GHz	19	35	“Zen 3”
AMD Ryzen 7 5800U	8C/16T	Up to 4.4 / 1.9 GHz	20	15	“Zen 3”
AMD Ryzen 7 5700U	8C/16T	Up to 4.3 /1.8 GHz	12	15	“Zen 2”
AMD Ryzen 5 5600U	6C/12T	Up to 4.2 / 2.3 GHz	19	15	“Zen 3”
AMD Ryzen 5 5500U	6C/12T	Up to 4.0 / 2.1G Hz	11	15	“Zen 2”
AMD Ryzen 3 5300U	4C/8T	Up to 3.8 / 2.6 GHz	6	15	“Zen 2”

Available in the first half of 2021, the Ryzen PRO 5000 Series Mobile Processors provide new levels of productivity and collaboration along with seamless manageability to meet the ever-shifting demands of modern work environments. The Ryzen PRO 5000 Series Mobile Processors also offer enterprise-level security features with innovative layers of defense at the silicon, OS and platform levels, giving IT teams confidence their PCs have protection, no matter where their workforce is stationed.

AMD Ryzen Desktop Processors

AMD is also announcing reduced-TDP alternatives to the award-winning AMD Ryzen 9 5900X and AMD Ryzen 7 5800X desktop processors, coming to pre-built OEM systems only. Powered by the new “Zen 3” core architecture and with a lower 65W TDP, the Ryzen 9 5900 desktop processor offers an average of 24% faster 1080p gaming across select titles compared to the prior generation⁷.

Product Specification: AMD Ryzen 5000 Series Desktop Processors

Model	Cores/Threads	Boost⁵ /Base⁶ Frequency (GHz)	Cache (MB)	TDP (Watts)
AMD Ryzen 9 5900	12C/24T	Up to 4.7 / 3.0 GHz	70	65
AMD Ryzen 7 5800	8C/16T	Up to 4.6 / 3.4 GHz	36	65

Additionally, AMD Ryzen Threadripper PRO Processors will now be directly available to consumers through participating global retailers, e-tailers and system integrators with on-shelf availability expected in March 2021. Ryzen Threadripper PRO Processors offer an unmatched feature set to workstation customers with up to 64 cores, 8 channels of memory, RDIMM and LRDIMM support, 128 PCIe® Gen 4 lanes, and AMD PRO security technologies.

Product Specification: AMD Ryzen Threadripper PRO

Model	Cores/ Threads	Boost⁵ /Base⁶ Frequency (GHz)	Total Cache (MB)	TDP (Watts)
AMD Ryzen Threadripper PRO 3995WX	64C/128T	Up to 4.2 / 2.7 GHz	288	280
AMD Ryzen Threadripper PRO 3975WX	32C/64T	Up to 4.2 / 3.5 GHz	144	280
AMD Ryzen Threadripper PRO 3955WX	16C/32T	Up to 4.3 / 3.9 GHz	72	280

Partner Quotes

“As the world continues to embrace a flexible, remote lifestyle, ASUS is constantly innovating to bring consumers the products they need to stay connected no matter where in the world they are gaming, streaming or working,” said Eric Chen, corporate senior vice president, ASUS. “ASUS is also pleased to continue to work with AMD to deliver cutting-edge innovations to raise the bar of gaming performance for mobile and gaming users everywhere.”

“Today’s employees and IT teams are continuing to adapt to new ways of collaborating and creating – whether at home, in the office or other remote locations,” said Andy Rhodes, global head of Commercial Personal Systems, HP Inc. “We are proud of our continued collaboration with AMD to offer powerful and highly secure business PCs to help people stay connected, engaged, and productive wherever they are.”

“Lenovo listens to customer feedback to derive user insights for innovation. What’s demanded of us during this new ‘remote revolution’ is simple—top performance to help foster more real-time collaboration. By partnering with AMD, we deliver on both counts to provide amazing user experiences,” said Dilip Bhatia, chief customer experience officer, Lenovo. “From small business pros working together on the new ThinkBook 14p Gen 2 and ThinkBook 16p Gen 2 laptops, to competitive gamers whose team is playing to win on this season’s powerful new Lenovo Legion laptops—staying productive and entertained with the latest Ryzen mobile processor technology is essential to those thriving in today’s blended work- and play-from-home lifestyle.”

Supporting Resources

Watch the AMD CES keynote with CEO Dr. Lisa Su
Learn more about AMD Ryzen Mobile Processors
Learn more about Ryzen for Business
Learn more about the AMD Ryzen Desktop Processors
Learn more about AMD Ryzen Threadripper PRO Processors
Become a fan of AMD on Facebook
Follow AMD on Twitter

About AMD

For 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ:AMD) website, blog, Facebook and Twitter pages.

Footnotes

‘Best Mobile Processors’ is defined as having the highest multi-thread processing performance in each of four (4) classes of Ryzen 5000 series processors. Testing by AMD engineering using the Cinebench R20 nT benchmark, measuring multithreaded performance of a Ryzen 9 5900HX processor engineering sample vs Core i9-10980HK, Ryzen 7 5800U processor engineering sample vs Core i7-1185G7 processor, the Ryzen 5 5600U processor engineering sample vs Core i5-1135G7 processor, and a Ryzen 3 5400U processor engineering sample vs Core i3-1115G4 processor. Performance may vary. CZM-1.
Testing by AMD engineering using the Cinebench R20 nT benchmark to measure the single-threaded and multithreaded performance of a Ryzen 7 5980X processor engineering sample vs. the previous generation Ryzen 9 4900H processor. Performance may vary. CZM-50.
Testing by AMD Performance Labs as of 09/02/2020 utilizing engineering platforms configured with Ryzen 7 5800U and Ryzen 7 4800U processors, each with 32GB RAM, 512MB SSD, Radeon Graphics, and Win 10 vs. a similarly configured Dell XPS 7390 laptop with a Core i7-1065G7 processor, Integrated Graphics and 16GB RAM, in the following benchmarks: Cinebench R20 nT, Cinebench R20 1T and 3DMark Physics for gaming performance. Performance may vary. 3DMark is a registered trademark of Futuremark Corporation. – CZM-11
Testing by AMD Performance Labs as of 12/08/2020 using an AMD Ryzen 7 5800U processor on an AMD Reference Platform configured with a 53WHr battery, WLAN enabled and Bluetooth off, using 1080p video playback (result: up to 21.4 hours) and the MobileMark 2018 benchmark test (result: up to 17.5 hours). CZM-33.
Max boost for AMD Ryzen Processors is the maximum frequency achievable by a single core on the processor running a bursty single-threaded workload. Max boost will vary based on several factors, including, but not limited to: thermal paste; system cooling; motherboard design and BIOS; the latest AMD chipset driver; and the latest OS updates. GD-150
Base frequency is the approximate processor clock speed of a typical workload running at the processor’s standard TDP. GD-166.
Testing by AMD performance labs as of December 11, 2020 measuring the gaming performance of an AMD Ryzen 9 5900 vs an AMD Ryzen 9 3900 in 12 popular titles at 1920×1080, High image quality preset. Systems configured with a GeForce RTX 2080 Ti. Results may vary. R5K-055

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Basler boost: CXP Cameras with 20, 32, and 45 MP Resolution

Tue, 12 Jan 2021 14:15:04 GMT

Customers will benefit from six new camera models in the Basler boost series with excellent image quality thanks to sensors from ON Semiconductor’s XGS series. The cameras are suitable for applications requiring high resolution and high precision with a large field of view.

Ahrensburg, January 12, 2021 – Basler AG is expanding its boost camera series with CoaXPress 2.0 (CXP 2.0) interface by six new models with sensors from ON Semiconductor’s XGS series for applications requiring high accuracy. The new boost cameras offer resolutions of 20, 32 and 45 megapixels (8k) and complement the boost series, which of course continues to be available with the proven Sony Pregius sensors IMX255 (9 MP) and IMX253 (12 MP).

The new models incorporate high-performance CMOS sensors with state-of-the-art global shutter technology and deliver frame rates of up to 45 fps. As a perfect replacement for older CCD sensors, the high-resolution XGS sensors offer outstanding image quality at higher frame rates and lower costs.

Thanks to their CXP 2.0 interface, Basler boost cameras are ideally suited for applications with image transmission distances of up to 40 m where high data rates and resolutions are required. These can be applications in the semiconductor industry, photovoltaics, display inspection, the printing and packaging industry, and medical technology.

The new models are available as a bundle with the Basler CXP-12 Interface Card 1C. In addition, Basler offers further high-end components for the use of the cameras from a single source, such as high-resolution F-mount lenses and CoaXPress cables – with all the advantages of the CXP 2.0 standard. More information can be found at baslerweb.com/boost.

Basler is a leading international manufacturer of high-quality imaging components for computer vision applications. In addition to classic area scan and line scan cameras, lenses, frame grabbers, light modules, and software, the company offers embedded vision modules and solutions, 3D products, as well as customized products and consulting services. Basler’s products are used in a variety of markets and applications, including factory automation, medical, logistics, retail, and robotics. They are characterized by high reliability, an excellent price/performance ratio, and long-term availability. Founded in 1988, the Basler Group employs around 800 people at its headquarters in Ahrensburg and other locations in Europe, Asia and North America. Thanks to its worldwide sales and service organization and cooperation with renowned partners, it offers solutions that fit for customers from a wide range of sectors.

For more information contact us by phone at +49 4102 463 500, by email at sales.europe@baslerweb.com or via our website at www.baslerweb.com.

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CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation ...

Tue, 12 Jan 2021 12:00:33 GMT

SensPro2 delivers up to 6X DSP performance improvement in computer vision, 2X AI inferencing improvement and 20% lower power compared to 1st generation SensPro, at the same process node
New, low power, entry-level SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and spatial audio
Automotive-ready SensPro2 DSP with high-precision floating-point capability targets electric powertrain battery management and Radar systems

Rockville, MD., – January 12, 2021 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today introduced its 2nd generation SensPro DSP family, a hub for AI and DSP processing workloads associated with a wide range of sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units (IMUs). SensPro2 builds on CEVA’s industry leadership in sensor hub DSPs, delivering 6X more DSP processing for computer vision, 8X more DSP performance for Radar processing, a 2X improvement in AI inferencing, and 20% more power efficient versus its predecessor, at the same process node.

The SensPro2 family has been expanded to include seven vector DSP cores, scaling in power and performance. The new entry-level cores address DSP and AI workloads requiring up to 1 TOPS AI performance and the high-end cores reach 3.2 TOPS. Each of the SensPro2 family members can be configured with application-specific instruction set architectures (ISAs) for radar, audio, computer vision and SLAM, along with parallel vector compute options for floating point and integer data types, to get the highest efficiency sensor hub DSP for their specific use-case.

“Our new SensPro2 family of power-efficient sensor hub DSPs offers scalable performance, multiple precisions and high utilization for the increasingly complex and diverse AI/sensor workloads of contextually-aware devices,” said Ran Snir, Vice President of R&D at CEVA. “The SensPro2 architecture is unique and innovative and uses a common ISA enabling seamless software reusability across all the SensPro2 DSPs. Our customers highly value this, along with the application-specific ISAs, as they increasingly utilize SensPro2 cores in their product designs.”

The SensPro2 architecture adopts a range of enhancements that have increased the performance and boosted efficiency for multitasking sensing and AI use cases, such as a new low power vector DSP architecture. For automotive powertrain applications, the upgraded floating-point DSPs offer high-precision performance, addressing the electrification trend with a powerful processor. Moreover, the SensPro2 architecture and cores are automotive ready with ASIL B hardware random faults and ASIL D systematic fault certification. In terms of performance, SensPro2 is capable of delivering up to 3.2 TOPS for 8×8 networks inferencing running at 1.6GHz, and doubles the memory bandwidth from the 1st generation, to more efficiently address data-intensive fully-connected layers.

The 2nd generation SensPro DSP family consists of:

The SP100 and SP50 DSPs, with 128 and 64 INT8 MACS, respectively. These DSPs offer the smallest die size and deliver a 10X performance improvement for DeepSpeech2 speech recognition neural network, compared to the CEVA-BX2 scalar DSP, and are ideal for audio AI workloads, such as conversational assistants, sound analytics, and natural language processing (NLP).
The SP1000, SP500 and SP250 DSPs with 1024, 512, and 256 INT8 MACs, respectively. These DSPs offer the highest performance and precision in the SensPro2 family, with optimal configurability for computer vision, SLAM, Radar, and AI workloads.
The SPF4 and SPF2 floating point DSPs, with 64 and 32 single precision floating point MACs, respectively. These DSPs are optimized for electric vehicle powertrain control and battery management systems, complemented by a full suite of Eigen Linear Algebra, MATLAB vector libraries and support for Glow graph compiler.

SensPro2 is supported by a broad portfolio of software infrastructure to expedite system designs including an LLVM C/C++ compiler, Eclipse based integrated development environment (IDE), OpenVX API, software libraries for OpenCL, CEVA deep neural network (CDNN) graph compilerincluding the CDNN-Invite API for inclusion of custom AI engines, CEVA-CV imaging functions, CEVA-SLAM software development kit and vision libraries, Radar SDK, ClearVox noise reduction, WhisPro speech recognition, MotionEngine sensor fusion, Tensor Flow Lite Micro support, and the SenslinQ software framework.

Availability

The SensPro2 architecture and cores are available now for general licensing. For more information, visit https://www.ceva-dsp.com/product/ceva-SensPro/.

CEVA is the leading licensor of wireless connectivity and smart sensing technologies. We offer Digital Signal Processors, AI processors, wireless platforms and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence, all of which are key enabling technologies for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial and IoT. Our ultra-low-power IPs include comprehensive DSP-based platforms for 5G baseband processing in mobile and infrastructure, advanced imaging and computer vision for any camera-enabled device and audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For sensor fusion, our Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and IMU solutions for AR/VR, robotics, remote controls, and IoT. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For wireless IoT, we offer the industry’s most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax) and NB-IoT. Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube , Facebook, LinkedIn and Instagram.

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"Deep Learning for Manufacturing Inspection: Case Studies,” a Presentation from FLIR Systems

Tue, 12 Jan 2021 09:00:56 GMT

Stephen Se, Senior Research Manager at FLIR Systems, presents the “Deep Learning for Manufacturing Inspection: Case Studies” tutorial at the September 2020 Embedded Vision Summit. Deep learning has revolutionized artificial intelligence and has been shown to provide the best solutions to many problems in computer vision, image classification, speech recognition…

“Deep Learning for Manufacturing Inspection: Case Studies,” a Presentation from FLIR Systems

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CES 2021: Intel Announces Four New Processor Families

Tue, 12 Jan 2021 02:38:03 GMT

Delivering the Best Business, Education, Mobile and Gaming Computing Platforms for More Than 500 New PC Designs Coming in 2021

NEWS HIGHLIGHTS

At its CES news conference, Intel highlighted how it is driving technology leadership with the introduction of more than 50 processors, resulting in more than 500 new designs for laptops and desktops coming to market in 2021.
Intel launched the 11th Gen Intel^® Core vPro^® platform and Intel^® Evo vPro^® platform, delivering the highest performance and most comprehensive hardware-based security¹.
Intel introduced the new N-series 10-nanometer Intel^® Pentium^® Silver and Intel^® Celeron^® processors that offer an unmatched balance of performance, media and collaboration for education systems.
Intel announced a new line of 11th Gen Intel^® Core H-series mobile processors for gaming platforms that deliver an industry-leading balance of mobility and enthusiast-level gaming.
Intel also previewed products coming to market later in 2021, including 11th Gen Intel^® Core S-series desktop processors (code-named “Rocket Lake-S”) and its next-generation processors (code-named “Alder Lake”).

SANTA CLARA, Calif., Jan. 11, 2021 – In a world where computing is pervasive and intelligence is distributed across every surface – from the cloud to the network to the intelligent edge – Intel today at CES 2021 highlighted how it is driving technology leadership to define the future of computing for people, business and society.

To help people navigate through this extraordinary time, Intel introduced new processors for business, education, mobile and gaming computing platforms – all designed to offer the premium PC experiences people deserve, with the most choices and no limits.

More: Intel at CES 2021 (Press Kit) | Mobileye Innovation Will Bring AVs to Everyone, Everywhere (News Release) | 2021 CES Keynote News Conference (Press/Analyst Deck) | 11th Gen Intel vPro Platform (Product Brief) | 11th Gen Intel Core H Series Processors (Product Brief) | 11th Gen Intel Core H Series Processors for Ultraportable Gaming (Press Deck)

“Only Intel has the breadth of products spanning multiple architectures; the large, open ecosystem; sheer scale of manufacturing footprint; and deep technical expertise customers need to unlock opportunities in this era of distributed intelligence,” said Intel Executive Vice President Gregory Bryant. “With an intense focus on execution for our core products and across our broader portfolio, we’re introducing a series of leadership products at CES with more following throughout the year.”

Introducing 11th Gen Intel^® Core vPro^®: The Best Platform for Business

For business, Intel introduced the 11th Gen Intel vPro platform, an unrivaled business platform delivering the industry’s highest performance and world’s most comprehensive hardware-based security². The new 11th Gen Intel Core vPro processors unveiled today are based on the world’s best business processor for thin-and-light laptops² and, when combined with the new Intel Core vPro platform, offer:

Intel® Hardware Shield, providing the world’s most comprehensive security deep in hardware for business³ and the industry’s first silicon-enabled artificial intelligence (AI) threat detection to help stop ransomware and crypto-mining attacks. It is also equipped with Intel® Control Flow Enforcement Technology, ground-breaking technology to help shut down an entire class of attacks that long evaded software-only solutions⁴.
Intel 10-nanometer (nm) SuperFin technology, delivering industry-leading performance, Intel® Iris® X^e graphics and the world’s biggest Wi-Fi improvement in 20 years – with integrated Intel® Wi-Fi 6/6E (Gig+) that enables up to six times faster uploads and downloads in the office and nearly three times faster speeds at home versus standard Wi-Fi 5⁵.
Eight times⁶ better AI performance, enabling businesses new compute power to keep pace with the fast-changing software ecosystem, and up to 2.3 times faster⁷ creation and video editing compared to the previous generation.
Up to 23% faster productivity⁸ than the competition when using apps like Office 365 and the best business collaboration experience, enabling more than 50% faster⁹ office productivity compared to the competition while on a video conference call.

Intel also launched the Intel® Evo vPro® platform, the best laptop experience for business users¹⁰. Laptop designs verified on the Intel Evo vPro platform are stylish, thin and light and provide an amazing immersive visual experience. They also offer remarkable responsiveness, instant wake and real-world battery life. More than 60 new laptops from top manufacturers will be available this year, combining the security and manageability of vPro and the amazing on-the-go experiences of Intel Evo. Additionally, Intel announced Intel Evo Chromebooks, enabling a new class of premium Chromebooks.

New Processors and Partnerships for Best Education Platform

Use of the PC as an essential education tool has accelerated greatly worldwide over the past year. To meet the growing needs of students, Intel introduced new N-series Intel^® Pentium^® Silver and Celeron^® processors with an unmatched balance of performance, media and collaboration for education systems. The processors are designed on Intel’s 10nm architecture, delivering up to 35%¹¹ better overall application performance and up to 78% better graphics performance gen on gen. This enables smooth application performance and browsing while multitasking, plus advanced camera and connectivity features for an enriched video conferencing and viewing experience.

As critical as advancing technology for meeting students’ evolving needs is putting laptops in their hands. Even with accelerated adoption, up to 30% of U.S. school children still lack internet or laptops for learning, and the pandemic has only exacerbated those requirements. During the last 15 years, Intel has invested more than $1 billion globally in education, including training for more than 15 million teachers. Last April, Intel launched the Online Learning Initiative and has provided hundreds of thousands of devices, as well as connectivity and resources, to students worldwide. Intel will continue these efforts in 2021 along with partners from inside and outside the technology industry.

New Line of 11th Gen Intel® Core H-series Mobile Processors for the Best Gaming Platforms

Intel launched a new line of 11th Gen Intel Core H-series mobile processors for gaming that extends the 11th Gen mobile family of products and pushes the limits of what’s possible for enthusiast-level gaming in laptops as thin as 16 millimeters. Led by the Intel® Core i7 Special Edition 4-core processor with up to 5 gigahertz (GHz) Turbo, these H35 processors are specifically targeted for ultraportable gaming. They feature new Gen 4 PCIE architecture for connecting to latest discrete graphics and deliver amazingly low latency and immersive game play on the go. At CES, Acer, ASUS, MSI and Vaio announced new systems powered by the 11th Gen Intel Core H35-series processor for ultraportable gaming, with more than 40 designs from top manufacturing partners launching in the first half of 2021.

For mobile enthusiasts who want desktop-caliber gaming and creation performance, Intel also announced an 8-core processor that will start shipping later this quarter. This platform is unique in the industry with features that would normally only be found in high-end desktop systems – including up to 5GHz, 20 lanes of PCIe Gen 4.0 architecture for fastest storage and discrete graphics, and Intel® Killer Wi-fi 6E (Gig+).

Preview of Next-Generation “Rocket Lake” and “Alder Lake” Technologies for Leadership Desktop and Mobile Platforms

Intel also demonstrated next-generation desktop technology for gamers and enthusiasts coming to market in 11th Gen Intel® Core S-series desktop processors (“Rocket Lake-S”). Featuring 19% gen-over-gen instructions per cycle (IPC) improvement¹² for the highest frequency cores and headlined by the Intel Core i9-11900K, these processors will bring even more performance to gamers and PC enthusiasts at launch in the first quarter of 2021.

Additionally, Intel demonstrated “Alder Lake,” the next-generation processor that represents a significant breakthrough in x86 architecture and Intel’s most power-scalable system-on-chip. Due in second half of 2021, Alder Lake will combine high-performance cores and high-efficiency cores into a single product. Alder Lake will also be Intel’s first processor built on a new, enhanced version of 10nm SuperFin and will serve as the foundation for leadership desktop and mobile processors that deliver smarter, faster and more efficient real-world computing.

¹In thin & light Windows-based devices, based on 1) unique features and performance testing on industry benchmarks and Representative Usage Guides across 3 key usages: productivity, creation, and collaboration, comparing Intel® Core vPro® i7-1185G7 to AMD Ryzen 7 PRO 4750U and 2) an IOActive study (commissioned by Intel) comparing Intel® Hardware Shield security capabilities on 11th Gen Intel Core vPro processors with corresponding competitor technologies. All testing as of December 2020. Visit www.Intel.com/11thgenvpro for details. Results may vary.

²In thin & light Windows-based devices, based on unique features and performance testing (as of December 1, 2020) on industry benchmarks and Representative Usage Guides across 3 key usages: productivity, creation, and collaboration of Intel® Core vPro® i7-1185G7, including in comparison to AMD Ryzen 7 PRO 4750U. Visit www.Intel.com/11thgenvpro for details. Results may vary.

³In thin & light Windows-based devices, based on unique features and testing by IOActive (commissioned by Intel; as of December 2020) comparing Intel® Hardware Shield security capabilities with corresponding technologies in an AMD Ryzen Pro 4750U-based system. Visit www.intel.com/11thgenvpro for details. Results may vary.

⁴Intel Control-flow Enforcement Technology (CET) is designed to help protect against jump/call-oriented programming (JOP/COP) attack methods and return-oriented programming (ROP) attack methods, malware known as memory safety issues and which comprise over half of ZDI-disclosed vulnerabilities. Visit www.intel.com/11thgenvpro for details. Results may vary.

⁵For more information about the data presented, visit www.intel.com/wifi6disclaimers.

⁶As measured by MLPerf v0.7 Inference, Mobile Notebooks, Closed Division with Offline Scenario using OpenVINO 2021.1 Pre framework on MobileNetEdge model int8 GPU (Batch=16) on 11th Gen Intel® Core i7-1185G7 Processor vs highest attainable MLPerfv0.7 Inference, Mobile Notebooks, Closed Division with Offline Scenario using OpenVINO 2021.1 Pre framework on MobileNetEdge model int8 GPU (Batch=1) on 10th Gen Intel® Core vPro® i7-10810U processor

⁷As measured by Video Editing workflow. 11th Gen Intel® Core vPro® i7-1185G7 Processor vs. 10th Gen Intel® Core vPro® i7-10610U Processor

⁸As measured by Microsoft Office 365 workflow. 11th Gen Intel® Core vPro® i7-1185G7 Processor vs. MD Ryzen 7 PRO 4750U

⁹As measured by Productivity and Collaboration Workflow. 11th Gen Intel® Core vPro® i7-1185G7 Processor vs. AMD Ryzen 7 PRO 4750U

¹⁰In thin & light Windows-based devices, based on 1) unique features and performance testing on industry benchmarks and Representative Usage Guides across 3 key usages: productivity, creation, and collaboration, comparing Intel® Core vPro® i7-1185G7to AMD Ryzen 7 PRO 4750U and 2) an IOActive study (commissioned by Intel) comparing Intel® Hardware Shield security capabilities on 11th Gen Intel Core vPro processors with corresponding competitor technologies. All testing as of December 2020. Intel Evo vPro designs are co-engineered as part of Intel’s comprehensive laptop innovation program Project Athena then tested, measured, and verified against a premium specification and key experience indicators to ensure unparalleled user experiences. Visit www.Intel.com/11thgenvpro for details. Results may vary.

¹¹Source: Intel estimates as of January 2021. Based on measurements on Intel Pentium Silver and Celeron measured on platforms with Intel® Pentium® Silver N6000 Processor, PL1=6W TDP, PL2 = 20W 4C4T, Turbo up to 3.3GHz, Motherboard: JSL RVP, Graphics: Intel® UHD Graphics 605, Memory: 2x4GB DDR4- 3200, Storage: 512GB Intel SSD 660P, OS: Windows* 10 20 H1, OS Version 19041.546, BIOS : 2385.02_140 vs. Intel® Pentium® N5030 Processor, PL1=6W TDP, PL2 = 15W 4C4T, Turbo up to 3.1GHz, Motherboard: GLK RVP, Graphics: Intel® UHD Graphics 605, Memory: 2x4GB DDR4 -2400, Storage: 256GB Intel® SSD 540s Series, OS: Windows* 10 19H1, OS Version: 10.0.19041.630 BIOS : 0064_42

¹²Source: Intel estimates as of January 2021. Based on measurements on Intel Internal reference platforms running SPEC CPU 2017 1-copy rate on 11th Gen Intel® Core i9-11900K vs 10th Gen Intel® Core i9-10900K (running each at the same fixed frequency).

Performance varies by use, configuration and other factors. Learn more at www.Intel.com/PerformanceIndex.

Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available updates. See CES 2021 Claim Appendix on intel.com/PerformanceIndex for configuration details. No product or component can be absolutely secure.

Your costs and results may vary.

Intel technologies may require enabled hardware, software or service activation.

About Intel

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CES 2021: Mobileye Innovation Will Bring AVs to Everyone, Everywhere

Tue, 12 Jan 2021 02:28:21 GMT

Progress Includes Automated Crowdsourced Mapping, New Lidar SoC, Software-Defined Radar and AV Test Vehicles in Four New Countries

NEWS HIGHLIGHTS

Automated, worldwide autonomous vehicle (AV) mapping capability allows Mobileye to expand its AV test fleets; new vehicles expected in Detroit, Tokyo, Shanghai, Paris and (pending regulation) New York City early this year.
Intel brings its XPU strategy, expertise and manufacturing capability in silicon photonics to develop a lidar system-on-chip (SoC) for Mobileye use in AVs starting in 2025.
Mobileye plans a software-defined radar customized to autonomous vehicles.
Mobileye reveals that cars using its existing technology have mapped nearly 1 billion kilometers globally, with more than 8 million kilometers mapped daily.

Jerusalem, Jan. 11, 2021 — Mobileye, an Intel Company, today previewed the strategy and technology that will enable autonomous vehicles (AV) to fulfill their lifesaving promise globally. During two sessions at this week’s Consumer Electronics Show, Mobileye president and chief executive officer Amnon Shashua will explain how Mobileye is set up to win globally in the AV industry.

“The backing of Intel and the trinity of our approach means that Mobileye can scale at an unprecedented manner,” Shashua said. “From the beginning, every part of our plan aims for rapid geographic and economic scalability – and today’s news shows how our innovations are enabling us to execute on that strategy.”

The Mobileye Trinity

In describing the trinity of the Mobileye approach, Shashua will explain the importance of delivering a sensing solution that is orders of magnitude more capable than human drivers. He will describe how Mobileye’s technology – including Road Experience Management (REM) mapping technology, rules-based Responsibility-Sensitive Safety (RSS) driving policy and two separate, truly redundant sensing subsystems based on world-leading camera, radar and lidar technology – combine to deliver such a solution.

More: Intel News Conference – Amnon Shashua:  It’s Time to Go (Video) | Intel Announces Four New Processor Families | Intel at CES 2021 (Press Kit) | Mobileye News | Autonomous Driving News

Mobileye’s approach solves the scale challenge from both a technology and business perspective. Getting the technology down to an affordable cost in line with the market for future AVs is crucial to enabling global proliferation. Mobileye’s solution starts with the inexpensive camera as the primary sensor combined with a secondary, truly redundant sensing system enabling safety-critical performance that is at least three orders of magnitude safer than humans. Using True Redundancy, Mobileye can validate this level of performance faster and at a lower cost than those who are doing so with a fused system.

New Radar and Lidar Technology

Shashua explained that the company envisions a future with AVs achieving enhanced radio- and light-based detection-and-ranging sensing, which is key to further raising the bar for road safety. Mobileye and Intel are introducing solutions that will innovatively deliver such advanced capabilities in radar and lidar for AVs while optimizing computing- and cost-efficiencies.

As described in Shashua’s “Under the Hood” session, Mobileye’s software-defined imaging radar technology with 2304 channels, 100DB dynamic range and 40 DBc side lobe level that together enable the radar to build a sensing state good enough for driving policy supporting autonomous driving. With fully digital and state-of-the-art signal processing, different scanning modes, rich raw detections and multi-frame tracking, Mobileye’s software-defined imaging radar represents a paradigm shift in architecture to enable a significant leap in performance.

Shashua also will explain how Intel’s specialized silicon photonics fab is able to put active and passive laser elements on a silicon chip. “This is really game-changing,” Shashua said of the lidar SoC expected in 2025. “And we call this a photonic integrated circuit, PIC. It has 184 vertical lines, and then those vertical lines are moved through optics. Having fabs that are able to do that, that’s very, very rare. So this gives Intel a significant advantage in building these lidars.”

Worldwide Maps Bring AVs Everywhere

In Monday’s session, Shashua will explain the thinking behind Mobileye’s crowdsourced mapping technology. Mobileye’s unique and unprecedented technology can now map the world automatically with nearly 8 million kilometers tracked daily and nearly 1 billion kilometers completed to date. This mapping process differs from other approaches in its attention to semantic details that are crucial to an AV’s ability to understand and contextualize its environment.

For AVs to realize their life-saving promise, they must proliferate widely and be able to drive almost everywhere. Mobileye’s automated map-making process uses technology deployed on nearly 1 million vehicles already equipped with Mobileye advanced driver-assistance technology.

To demonstrate the scalable benefits of these automatic AV maps, Mobileye will start driving its AVs in four new countries without sending specialized engineers to those new locations. The company will instead send vehicles to local teams that support Mobileye customers. After appropriate training for safety, those vehicles will be able to drive. This approach was used in 2020 to enable AVs to start driving in Munich and Detroit within a few days.

Find out More

Watch Mobileye’s day one press conference at 10 a.m. PST Monday, Jan. 11, and the deeper technology session at 10 a.m. PST Tuesday, Jan. 12. Both will be broadcast on the Intel Newsroom.

About Mobileye

Mobileye is the global leader in the development of computer vision and machine learning, data analysis, localization and mapping for Advanced Driver Assistance Systems and autonomous driving. Mobileye’s technology helps keep passengers safer on the roads, reduces the risks of traffic accidents, saves lives and has the potential to revolutionize the driving experience by enabling autonomous driving. Mobileye’s proprietary software algorithms and EyeQ® chips perform detailed interpretations of the visual field in order to anticipate possible collisions with other vehicles, pedestrians, cyclists, animals, debris and other obstacles. Mobileye’s products are also able to detect roadway markings such as lanes, road boundaries, barriers and similar items; identify and read traffic signs, directional signs and traffic lights; create a RoadBook of localized drivable paths and visual landmarks using REM; and provide mapping for autonomous driving.

About Intel

The post CES 2021: Mobileye Innovation Will Bring AVs to Everyone, Everywhere appeared first on Edge AI and Vision Alliance.

Edge AI and Vision Alliance

Where AI Falls Short

A History of Inequality

Outcome vs. Intention

Exacerbating Underlying Problems

The Dangerous of Misuse and Mistrust

"Lessons From the Start-up Trenches,” a Presentation by and Interview with Oliver Gunasekara

Server Computing: A Data-intensive Market Propelled by AI

OUTLINE:

Market forecasts:

Yole Développement (Yole) expects the server computing market to reach US$33 billion in 2025.

AI and HPC dedicated products combined will reach 29Munits and US$8 billion in 2025.

Configurable SoC dedicated to AI inference will be more used following AI’s hype.

The CPU revenue will reach US$21 billion in 2025, driven by Standard Cloud servers and HPC.

Yole expects a 11% CAGR 2019−2025 for the HPC segment.

Market and technology trends:

Social and media applications are growing strongly, more workload needs to be computed.

Enterprise digitalization enhances the demand for hardware for virtualization and cloud computing for enterprises.

5G arrival will likely lead to a bunch of all new applications.

Limiting power consumption is critical to prevent an explosion in electricity consumption.

Supply chain:

Some big tech players are designing their own chips.

Intel, Nvidia, AMD, and Xilinx, the few logic leaders, still by far owned the largest part.

Acronyms

"Safer and More Efficient Intersections with Computer Vision,” a Presentation from Cubic ...

Chips&Media Adds Extraordinary Features in Next-Generation Video Codec IP: Introducing the ...

"CMOS Image Sensors: A Guide to Building the Eyes of a Vision System,” a Presentation ...

Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO

About Intel

Qualcomm to Acquire NUVIA

Augmenting its leading technology roadmap to redefine computing performance

Accelerating successful partnerships with OS providers for next-generation computing devices

Enabling Samsung and the mobile ecosystem to redefine premium performance for smartphones

Leading CPU talent to join Qualcomm’s best in class innovation culture

About Qualcomm

About NUVIA Inc.

January 13, 2021 Edge AI and Vision Alliance Member Briefing

Edge AI and Vision Insights: January 13, 2021 Edition

"Deep Learning on Mobile Devices,” a Presentation from Siddha Ganju

Arm’s Powerful Compute and Graphics Platform at the Heart of the New Samsung Exynos 2100

The octa-core CPU configuration

A leap forward in graphics performance

Bringing new experiences to your mobile

About Arm

NVIDIA Ampere Architecture Powers Record 70+ New GeForce RTX Laptops

GeForce RTX 30 Series Laptop GPUs Offer Up to 2x Efficiency, 3rd Gen Max-Q Technology, Start at $999

Third-Gen Max-Q Tech Delivers Optimal Power and Performance

Award-Winning NVIDIA Ampere Architecture, Plus New Ways to Play

Esports Laptops Play at 240+ FPS

GeForce RTX 30 Series Studio Laptops

Availability

About NVIDIA

NVIDIA Introduces GeForce RTX 3060, Next Generation of the World’s Most Popular GPU

Powered by NVIDIA Ampere Architecture, Delivers Up to 10x the Ray-Tracing Performance of GTX 1060; Starting at $329

NVIDIA DLSS: The AI Gift That Gamers Love

NVIDIA Reflex and Broadcast: The Ultimate Play

Advanced GeForce Experience Features

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About NVIDIA

AMD Announces World’s Best Mobile Processors¹ In CES 2021 Keynote

AMD Ryzen Threadripper PRO Processors, designed for the most demanding professional workloads, coming to retail channel

AMD Ryzen 5000 Series Mobile Processors

Product Specification: AMD Ryzen 5000 Series Mobile Processors

AMD Ryzen Desktop Processors

Product Specification: AMD Ryzen 5000 Series Desktop Processors

Product Specification: AMD Ryzen Threadripper PRO

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Basler boost: CXP Cameras with 20, 32, and 45 MP Resolution

Customers will benefit from six new camera models in the Basler boost series with excellent image quality thanks to sensors from ON Semiconductor’s XGS series. The cameras are suitable for applications requiring high resolution and high precision with a large field of view.

CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation ...

SensPro2 delivers up to 6X DSP performance improvement in computer vision, 2X AI inferencing improvement and 20% lower power compared to 1st generation SensPro, at the same process node

New, low power, entry-level SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and spatial audio

Automotive-ready SensPro2 DSP with high-precision floating-point capability targets electric powertrain battery management and Radar systems

Availability

"Deep Learning for Manufacturing Inspection: Case Studies,” a Presentation from FLIR Systems

CES 2021: Intel Announces Four New Processor Families

Delivering the Best Business, Education, Mobile and Gaming Computing Platforms for More Than 500 New PC Designs Coming in 2021

Introducing 11th Gen Intel^® Core vPro^®: The Best Platform for Business