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DENA: DENA - Designing Electronics North America

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Vishay Intertechnology, today announced its new thin film submount platform, designed to support next-generation optical transceivers, RF modules, and advanced electronic packaging applications requiring high thermal performance, precision alignment, and high fre...


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As the industry embarks on the transition to postquantum cryptography (PQC), Microchip Technology (Nasdaq: MCHP) is expanding its portfolio of Trust Shield, PQCready devices with the TS1800 Platform Root of Trustcontroller and the TS50x secure boot controller. The ...


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NewPower Worldwide today announced it was recognized by Hewlett Packard Enterprise (HPE) at the HPE Operations Partner Summit 2026, receiving the Spares Supply Chain Partner of the Year Award for outstanding performance as a global supply chain partner.

The award recognizes partners who deliver exceptional operational execution, responsiveness, and reliabilit...


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Bel Fuse Inc a leading global manufacturer of electronic components, today announced a strategic restructuring of its business units. This transformation marks a shift from a product-centric to an end-market-centric organization, designed to sharpen market focus, accelerate innovation, broaden our offering of product solutions, and enhance customer engagement across...


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Rising power density in modern electronics is pushing traditional thick film chip resistors beyond their thermal limits. In applications where high-power dissipation, electrical isolation, and long-term stability must coexist, aluminum nitride (AlN)–based thick film chip resistors are becoming the preferred solution. Stackpole Electronics’ RMAN series utilizes aluminum nitride s...

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